Abstract: An opto-electronic chip package having a rigid L-shaped chassis to which a flexible circuit board is attached. A first region of the flexible circuit board receives an opto-electronic chip. An optical fiber sub-assembly places at least one optical fiber in optical communication with at least one surface normal opto-electronic device on the opto-electronic chip. The opto-electronic chip package further includes a housing that receives the chassis, the circuit board and the optical fiber sub-assembly. Before placing the chassis, circuit board and optical fiber sub-assembly in the housing, a second region of the circuit board is attached to the chassis. As the chassis and circuit board are placed in the housing, the first region of the circuit board engages a lip of the housing. The lip forces the first region of the circuit board against the chassis such that the first region is perpendicular to the second region of the circuit board.