Abstract: A universal power adapter includes a power converter configured to generate an output power based on a switching frequency of the power converter. The universal power adapter also includes a frequency controller operatively coupled to the power converter and configured to control the switching frequency of the power converter. The universal power adapter further includes a switch capacitor circuit having a plurality of capacitive elements, operatively coupled to the power converter. The switch capacitor circuit is configured to switch between the plurality of capacitive elements. The universal power adapter also includes a capacitance controller operatively coupled to the switch capacitor circuit and configured to control the switch capacitor circuit to control switching between the plurality of capacitive elements to maintain a control parameter within a threshold range of.

Abstract: An illumination device is provided. The illumination device includes a light emitting source and a clamped series resonant converter (CSRC) coupled thereto. The CSRC includes a first rectifier to generate a direct current (DC) using an alternating current (AC) voltage. The CSRC further includes an inverter having a switching leg including a plurality of switches coupled in series and a diode leg having a plurality of diodes coupled in series. The diode leg is coupled in parallel with the switching leg. Furthermore, the inverter includes an inductor coupled to the switching leg and a capacitor coupled to the diode leg. The CSRC also includes a transformer coupled to the inverter, where a voltage developed across a primary winding of the transformer causes automatic power factor correction by drawing an input current flowing through the CSRC that is proportional to the AC voltage.

Abstract: A system includes a SiC semiconductor power device; a power supply board that is configured to provide power to a first gate driver board via a connector; the first gate driver board that is coupled and configured to provide current to the SiC semiconductor power device, wherein the first gate driver board is coupled to the power supply board via the connector, and wherein the first gate driver board is separated from the power supply board; and an interconnect board that is coupled to the first gate driver board, wherein the interconnect board is configured to couple the first gate driver board a second gate driver board.

Abstract: A system includes a SiC semiconductor power device; a power supply board that is configured to provide power to a first gate driver board via a connector; the first gate driver board that is coupled and configured to provide current to the SiC semiconductor power device, wherein the first gate driver board is coupled to the power supply board via the connector, and wherein the first gate driver board is separated from the power supply board; and an interconnect board that is coupled to the first gate driver board, wherein the interconnect board is configured to couple the first gate driver board a second gate driver board.

Abstract: A universal power adapter includes a power converter configured to generate an output power based on a switching frequency of the power converter. The universal power adapter also includes a frequency controller operatively coupled to the power converter and configured to control the switching frequency of the power converter. The universal power adapter further includes a switch capacitor circuit having a plurality of capacitive elements, operatively coupled to the power converter. The switch capacitor circuit is configured to switch between the plurality of capacitive elements. The universal power adapter also includes a capacitance controller operatively coupled to the switch capacitor circuit and configured to control the switch capacitor circuit to control switching between the plurality of capacitive elements to maintain a control parameter within a threshold range of.

Abstract: Systems and methods are disclosed for reducing an interwinding capacitance current in a transformer. In certain embodiments, the transformer includes a coupling winding and a primary winding that encircles a portion of the coupling winding. Additionally, the transformer includes a secondary winding that encircles a portion of the coupling winding. The transformer includes a shield terminal which is electrically coupled to the coupling winding. The shield terminal directs currents, such as interwinding capacitance currents, in the coupling winding to ground.

Abstract: A driver system comprises a direct current (DC) voltage source and a first bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and configured to convert a first voltage on the primary side to a second voltage on the secondary. The driver system also comprises a second bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side coupled to the secondary side of the first bi-directional DC-to-DC converter and configured to convert the first voltage on the primary side to a third voltage on the secondary. The first and second bi-directional DC-to-DC converters are capable of boosting the first voltage, and the second control signal is a complement of the first control signal. A voltage difference between the second and third voltages comprises an output voltage that comprises an amplification of the first control signal.

Abstract: A system for driving a piezoelectric load includes a direct current (DC) voltage source and a bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and comprising a control input configured to receive a first control signal configured to control conversion of a first voltage on the primary side of the bi-directional DC-to-DC converter to a second voltage on the secondary side of the bi-directional DC-to-DC converter. The driver system also includes a capacitor coupled to the secondary side of the bi-directional DC-to-DC converter and configured to remove a DC offset of the second voltage and includes a reactive load having a first terminal coupled to the capacitor and a second terminal coupled to the secondary side of the bi-directional DC-to-DC converter.

Abstract: An induction cooktop appliance is provided. The induction cooktop appliance includes an induction heating element and a metal top panel positioned above the induction heating element for supporting cooking utensils thereon. The metal top panel defines an opening above the induction heating element. The opening can limit or regulate eddy currents within the metal top panel.

Abstract: An illumination device is provided. The illumination device includes a light emitting source, and a clamped series resonant converter operatively coupled to the light emitting source, where the clamped series resonant converter is configured to automatically regulate a load current generated by the clamped series resonant converter in response to a load voltage applied by the light emitting source.

Abstract: A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s).

Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.

Abstract: An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.

Abstract: A cooling system includes a synthetic jet having a first synthetic jet lead and a second synthetic jet lead. The cooling system also includes a capacitor having a first capacitor lead and a second capacitor lead. The first capacitor lead is coupled to the first synthetic jet lead. The synthetic jet is configured to be powered via an alternating current (AC) power source coupled to the second capacitor lead and to the second synthetic jet lead.

Abstract: A system for driving a piezoelectric load includes a direct current (DC) voltage source and a bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and comprising a control input configured to receive a first control signal configured to control conversion of a first voltage on the primary side of the bi-directional DC-to-DC converter to a second voltage on the secondary side of the bi-directional DC-to-DC converter. The driver system also includes a capacitor coupled to the secondary side of the bi-directional DC-to-DC converter and configured to remove a DC offset of the second voltage and includes a reactive load having a first terminal coupled to the capacitor and a second terminal coupled to the secondary side of the bi-directional DC-to-DC converter.

Abstract: A system for driving a piezoelectric load includes a direct current (DC) voltage source and a bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and comprising a control input configured to receive a first control signal configured to control conversion of a first voltage on the primary side of the bi-directional DC-to-DC converter to a second voltage on the secondary side of the bi-directional DC-to-DC converter. The driver system also includes a capacitor coupled to the secondary side of the bi-directional DC-to-DC converter and configured to remove a DC offset of the second voltage and includes a reactive load having a first terminal coupled to the capacitor and a second terminal coupled to the secondary side of the bi-directional DC-to-DC converter.

Abstract: An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.

Abstract: A driver system comprises a direct current (DC) voltage source and a first bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and configured to convert a first voltage on the primary side to a second voltage on the secondary. The driver system also comprises a second bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side coupled to the secondary side of the first bi-directional DC-to-DC converter and configured to convert the first voltage on the primary side to a third voltage on the secondary. The first and second bi-directional DC-to-DC converters are capable of boosting the first voltage, and the second control signal is a complement of the first control signal. A voltage difference between the second and third voltages comprises an output voltage that comprises an amplification of the first control signal.

Abstract: A driver system comprises a direct current (DC) voltage source and a first bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side and configured to convert a first voltage on the primary side to a second voltage on the secondary. The driver system also comprises a second bi-directional DC-to-DC converter having a primary side coupled to the DC voltage source and a secondary side coupled to the secondary side of the first bi-directional DC-to-DC converter and configured to convert the first voltage on the primary side to a third voltage on the secondary. The first and second bi-directional DC-to-DC converters are capable of boosting the first voltage, and the second control signal is a complement of the first control signal. A voltage difference between the second and third voltages comprises an output voltage that comprises an amplification of the first control signal.

Abstract: An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.