Patents by Inventor John Steinbach

John Steinbach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7087795
    Abstract: The invention relates to a hydroformylation method, whereby the homogeneous liquid reactor discharge is first supplied to a gas/liquid separator and then run through an extraction column with a counter-current of synthesis gas and finally fed to an evaporator. The invention is characterised in that the homogeneous liquid mass flow is supplied to the upper section of the extraction column at a temperature above 90° C.
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: August 8, 2006
    Assignee: Celanese Chemicals Europe GmbH
    Inventors: Thomas Krumrey, Kurt Schalapski, Robert Rapier, John Steinbach, Bak Shah, Mark Hewlett
  • Publication number: 20050065379
    Abstract: The invention relates to a hydroformylation method, whereby the homogeneous liquid reactor discharge is first supplied to a gas/liquid separator and then run through an extraction column with a counter-current of synthesis gas and finally fed to an evaporator. The invention is characterised in that the homogeneous liquid mass flow is supplied to the upper section of the extraction column at a temperature above 90° C.
    Type: Application
    Filed: November 27, 2002
    Publication date: March 24, 2005
    Applicant: Celanese Chemicals Europe GmbH
    Inventors: Thomas Krumrey, Kurt Schalapski, Robert Rapier, John Steinbach, Bak Shah, Mark Hewlett
  • Patent number: 4878979
    Abstract: A silicone rubber vacuum bag for use in composite article manufacture is reusably sealed to a mold, without mechanical clamping means. The mold-mating portion of the bag is primed with a silicone rubber adhesive, which is cured thereto, and a layer of semiadhesive sealer is applied between the primed mold-mating portion of the bag and the mold.
    Type: Grant
    Filed: April 25, 1986
    Date of Patent: November 7, 1989
    Assignee: United Technologies Corporation
    Inventor: John Steinbach