Patents by Inventor John Stephen Guzek

John Stephen Guzek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package with embedded die and its methods of fabrication
    Patent number: 8901724
    Abstract: Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.
    Type: Grant
    Filed: December 29, 2009
    Date of Patent: December 2, 2014
    Assignee: Intel Corporation
    Inventors: John Stephen Guzek, Javier Soto Gonzalez, Nicholas R. Watts, Ravi K. Nalla
  • Semiconductor package with embedded die and its methods of fabrication
    Publication number: 20110215464
    Abstract: Embodiments of the present invention describe a semiconductor package having an embedded die. The semiconductor package comprises a coreless substrate that contains the embedded die. The semiconductor package provides die stacking or package stacking capabilities. Furthermore, embodiments of the present invention describe a method of fabricating the semiconductor package that minimizes assembly costs.
    Type: Application
    Filed: December 29, 2009
    Publication date: September 8, 2011
    Inventors: John Stephen Guzek, Javier Soto Gonzalez, Nicholas R. Watts, Ravi K. Nalla