Abstract: An electronic interconnect includes a flexible circuit which has a plurality of contacts formed thereon. A plurality of springs is positioned so as to apply a compressive force to at least one of the contacts when the electronic interconnect is mated. A resilient material is configured to apply a compressive force to at least one of the springs.

Abstract: A Z-axis electrical interconnect includes a flexible printed circuit folded into a U-shape. The Z-axis electrical interconnect also includes a plurality of raised interconnection members arranged on the flexible printed circuit in a predetermined pattern and a circuit trace interconnecting the pair of raised interconnection members. The Z-axis electrical interconnect further includes a spring fixedly positioned on the flexible printed circuit to maintain the U-shape.

Abstract: A Z-axis electrical interconnect includes a flexible printed circuit folded into a U-shape. The Z-axis electrical interconnect also includes a plurality of raised interconnection members arranged on the flexible printed circuit in a predetermined pattern and a circuit trace interconnecting the pair of raised interconnection members. The Z-axis electrical interconnect further includes a spring fixedly positioned on the flexible printed circuit to maintain the U-shape.

Abstract: The connector assembly includes a housing that carries a flexible circuit member and two slide members with slide cam surfaces. A daughter board is secured to one surface on the housing and is electrically connected to the flexible circuit member. The cam surfaces on the two slide members engage cams on a mother board. Movement of the slide member cam surfaces relative to the cams on the mother board moves the housing relative to the mother board and forms an electrical connection between the flexible circuit member and the mother board. A linkage system moves both slide members to form and maintain the electrical connection between the flexible circuit member and the mother board.

Abstract: A connection system requiring little or no force to mechanically and electrically connect a printed circuit board to a flexible printed circuit. The connection system includes a flat and rigid carrier having an upper surface upon which is affixed a flexible printed circuit having an electrically conductive raised area in the form of a plurality of raised dots. At the upper surface, the carrier has a groove formed therein, wherein the raised dots are located in the groove. An elastomeric insert is situated in the groove in abutting relation to the flexible printed circuit behind the raised dots. A rigid printed circuit board has an electrically conductive area in the form of a plurality of pads. The printed circuit board is inserted into the groove, whereupon the elastomer resiliently compresses so as to press the plurality of raised dots into tight electrical contact with the plurality of pads. In a first preferred embodiment the printed circuit board is inserted vertically with slight force.

Abstract: A clamping mechanism (10) for connecting a printed circuit board (12) having a plurality of electrically conductive pads (14) to a flexible printed circuit having a plurality of electrically conductive raised dots (18). A housing (20) having a mouth (22) is located upon the printed circuit board at the plurality of pads. A pair of L-shaped leaf springs (28, 28') are connected with the housing. A cam body (40) having a rounded cam surface (42), an opposite grasping lever (44), and a pair of opposing first and second flat surfaces (46, 48) therebetween is rotatably connected to the leaf springs. A first stiffener (58) is attached to the flexible printed circuit opposite the raised dots thereof which is configured to alignably fit with the shape of the mouth of the housing to thereby align the raised dots with the pads. A second stiffener (54) is provided at the printed circuit board opposite the housing.

Abstract: The high power clip-on interconnection system of the present invention includes a terminal stud, clip terminal and cable. The clip is formed out of flat conductive material with good spring characteristics. The clip has a terminal end for securing to a cable, an adjustable diameter circular-shaped portion for securing to the stud, and an activation arm for adjusting the diameter of the circular-shaped portion.

Abstract: The invention includes a testing apparatus for testing integrated circuit chips during vibration. The apparatus includes a vibration fixture base which is a table that can be vibrated vertically and/or horizontally. The base supports a holding fixture for supporting a flexible circuit having circuit traces whose ends terminate in raised dots or bumps. The flexible circuit is clamped to the holding fixture to properly position the raised features at the end of the circuit traces. A holder and clamp unit holds a plurality of integrated circuit chips and clamps the chips against the bumps on the flexible circuit with predetermined pressure to make electrical contact between pads on the integrated circuit chip and the bumps. The clamp unit can be raised and lower and rotated. Even pressure is assured by a compressible layer carried in the fixture and located beneath the bumps. The contact points of the bumps and the integrated circuit chip pads vibrate in unison during vibration testing.