Patents by Inventor John STOPFORTH

John STOPFORTH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250114504
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS.
    Type: Application
    Filed: October 11, 2024
    Publication date: April 10, 2025
    Inventors: Senthilkumar MK, George WHYTE, John STOPFORTH, Claudia ACOSTA, Marco BARRON, Anton JEYSING
  • Patent number: 12138372
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS.
    Type: Grant
    Filed: June 2, 2023
    Date of Patent: November 12, 2024
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Senthilkumar Mk, George Whyte, John Stopforth, Claudia Acosta, Marco Barron, Anton Jeysing
  • Publication number: 20240082468
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS.
    Type: Application
    Filed: June 2, 2023
    Publication date: March 14, 2024
    Inventors: Senthilkumar MK, George WHYTE, John STOPFORTH, Claudia ACOSTA, Marco BARRON, Anton JEYSING
  • Patent number: 11701457
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS.
    Type: Grant
    Filed: December 4, 2017
    Date of Patent: July 18, 2023
    Assignee: HONEYWELL INTERNATIONAL INC.
    Inventors: Senthilkumar Mk, George Whyte, John Stopforth, Claudia Acosta, Marco Barron, Anton Jeysing
  • Publication number: 20200353143
    Abstract: Systems and methods include a heat transfer body with opposing major surfaces formed from a thermally conductive substrate in intimate thermal interaction with an alumina exterior surface that extends across the major surfaces of the body. In an illustrative example, the heat source may be a substantially planar, silicone-based heater source (P-SBHS). The heat transfer body may be configured to thermally interact, for example, heat from a heat source proximate a first of the major surfaces to a second of the major surfaces. A temperature sensor module may be located, for example, proximate to the first major surface such that a temperature sensor thermally interacts with the first major surface. The temperature sensor module may, for example, insulate the temperature sensor from the P-SBHS. The electrical insulation provided by the alumina exterior surface may reduce electrical leakage currents induced between the P-SBHS and, for example, patient and/or operator accessible parts.
    Type: Application
    Filed: December 4, 2017
    Publication date: November 12, 2020
    Inventors: Senthilkumar MK, George WHYTE, John STOPFORTH, Claudia ACOSTA, Marco BARRON, Anton JEYSING