Patents by Inventor John Suman Nakka

John Suman Nakka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits and molding approaches therefor
    Patent number: 9842776
    Abstract: Integrated circuit dies within a semiconductor wafer are separated using an approach that may facilitate mitigation of warpage, cracking and other undesirable aspects. As may be implemented in accordance with one or more embodiments, a semiconductor wafer is provided with a plurality of integrated circuit dies and first and second opposing surfaces, and with the second surface of the wafer being ground. A first mold compound is applied to the ground second surface, and the integrated circuit dies are separated along saw lanes while using the first mold compound to hold the dies in place. The integrated circuit dies are encapsulated with the mold compounds, by applying the second mold compound to the first surface and along sidewalls of the integrated circuit dies.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: December 12, 2017
    Assignee: NXP B.V.
    Inventors: John Suman Nakka, Tonny Kamphuis, Roelf Anco Jacob Groenhuis
  • INTEGRATED CIRCUITS AND MOLDING APPROACHES THEREFOR
    Publication number: 20170200646
    Abstract: Integrated circuit dies within a semiconductor wafer are separated using an approach that may facilitate mitigation of warpage, cracking and other undesirable aspects. As may be implemented in accordance with one or more embodiments, a semiconductor wafer is provided with a plurality of integrated circuit dies and first and second opposing surfaces, and with the second surface of the wafer being ground. A first mold compound is applied to the ground second surface, and the integrated circuit dies are separated along saw lanes while using the first mold compound to hold the dies in place. The integrated circuit dies are encapsulated with the mold compounds, by applying the second mold compound to the first surface and along sidewalls of the integrated circuit dies.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 13, 2017
    Inventors: John Suman Nakka, Tonny Kamphuis, Roelf Anco Jacob Groenhuis