Abstract: One or more embodiments of the invention include a heat sink device, system and method for removing heat from aircraft electronics including a chassis, an electronic unit, wherein the electronic unit is thermally coupled to the chassis, and a thermally conductive member, wherein the thermally conductive member includes a first interface for thermally contacting an electronic unit and a second interface for thermally contacting the chassis, the thermally conductive member being flexible in at least one direction between the first interface and the second interface to reduce load imparted on the electronic unit by the thermally conductive member in comparison to if the thermally conductive member were not flexible.