Patents by Inventor John T. Anderson

John T. Anderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11971598
    Abstract: A communications panel includes a chassis receiving one or more tray arrangements that each support one or more cassettes. Each cassette carries a plurality of ports at which connections are made between front and rear plug connectors. Each tray arrangement includes guides along which the cassettes slidably mount. The guides and cassettes are configured to enable cassettes of various size to mount to the same tray without reconfiguring the guides.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: April 30, 2024
    Assignee: COMMSCOPE TECHNOLOGIES LLC
    Inventors: David Jan Irma Van Baelen, John T. PFarr, Michael J. Wentworth, Scott C. Sievers, Matthew J. Holmberg, Jacob C. Anderson
  • Patent number: 9520057
    Abstract: A method, apparatus, and system are provided for monitoring environment parameters of critical facilities. A Remote Area Modular Monitoring (RAMM) apparatus is provided for monitoring environment parameters of critical facilities. The RAMM apparatus includes a battery power supply and a central processor. The RAMM apparatus includes a plurality of sensors monitoring the associated environment parameters and at least one communication module for transmitting one or more monitored environment parameters. The RAMM apparatus is powered by the battery power supply, controlled by the central processor operating a wireless sensor network (WSN) platform when the facility condition is disrupted. The RAMM apparatus includes a housing prepositioned at a strategic location, for example, where a dangerous build-up of contamination and radiation may preclude subsequent manned entrance and surveillance.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: December 13, 2016
    Assignee: UChicago Argonne, LLC
    Inventors: Hanchung Tsai, John T. Anderson, Yung Y. Liu
  • Patent number: 9250171
    Abstract: This invention is directed to a kit for performing adhesive audits and a method of doing the same. The kit and method can be used to improve the speed and ease with which adhesive audits are performed.
    Type: Grant
    Filed: October 12, 2012
    Date of Patent: February 2, 2016
    Assignee: H.B. Fuller Company
    Inventor: John T Anderson
  • Publication number: 20140375274
    Abstract: A method, apparatus, and system are provided for monitoring environment parameters of critical facilities. A Remote Area Modular Monitoring (RAMM) apparatus is provided for monitoring environment parameters of critical facilities. The RAMM apparatus includes a battery power supply and a central processor. The RAMM apparatus includes a plurality of sensors monitoring the associated environment parameters and at least one communication module for transmitting one or more monitored environment parameters. The RAMM apparatus is powered by the battery power supply, controlled by the central processor operating a wireless sensor network (WSN) platform when the facility condition is disrupted. The RAMM apparatus includes a housing prepositioned at a strategic location, for example, where a dangerous build-up of contamination and radiation may preclude subsequent manned entrance and surveillance.
    Type: Application
    Filed: June 16, 2014
    Publication date: December 25, 2014
    Inventors: Hanchung Tsai, John T. Anderson, Yung Y. Liu
  • Patent number: 8896894
    Abstract: A method of making structured microdots (154) for printing plate registration includes forming a first plurality of square spots (156) less than or equal to 11 microns; wherein a first group (157) of the first plurality of square spots is formed in a first pattern (158); and wherein the first pattern is less than or equal to 66 microns and comprises a first microdot.
    Type: Grant
    Filed: September 19, 2012
    Date of Patent: November 25, 2014
    Assignee: Eastman Kodak Company
    Inventor: John T. Anderson, III
  • Publication number: 20140076180
    Abstract: A system for forming security markings using structured microdots (154) on a printing plate includes a printhead for forming a first plurality of square spots (156) less than or equal to 11 microns; wherein a first group (157) of the first plurality of square spots is formed in a first pattern (158); and wherein the first pattern is less than or equal to 66 microns and comprises a first microdot.
    Type: Application
    Filed: September 19, 2012
    Publication date: March 20, 2014
    Inventor: John T. Anderson, III
  • Publication number: 20140076181
    Abstract: A system for forming structured microdots (154) on printing plate registration includes a printhead for forming a first plurality of square spots (156) less than or equal to 11 microns; wherein a first group (157) of the first plurality of square spots is formed in a first pattern (158); and wherein the first pattern is less than or equal to 66 microns and comprises a first microdot.
    Type: Application
    Filed: September 19, 2012
    Publication date: March 20, 2014
    Inventor: John T. Anderson, III
  • Publication number: 20140078556
    Abstract: A method of forming security markings on a printing plate includes forming a first plurality of square spots (156) less than or equal to 11 microns; wherein a first group (157) of the first plurality of square spots is formed in a first pattern (158); and wherein the first pattern is less than or equal to 66 microns and comprises a first microdot.
    Type: Application
    Filed: September 19, 2012
    Publication date: March 20, 2014
    Inventor: John T. Anderson, III
  • Publication number: 20140076184
    Abstract: A method of making structured microdots (154) for printing plate registration includes forming a first plurality of square spots (156) less than or equal to 11 microns; wherein a first group (157) of the first plurality of square spots is formed in a first pattern (158); and wherein the first pattern is less than or equal to 66 microns and comprises a first microdot.
    Type: Application
    Filed: September 19, 2012
    Publication date: March 20, 2014
    Inventor: John T. Anderson III
  • Publication number: 20130298660
    Abstract: This invention is directed to a kit for performing adhesive audits and a method of doing the same.
    Type: Application
    Filed: October 12, 2012
    Publication date: November 14, 2013
    Applicant: H.B. Fuller Company
    Inventor: JOHN T. ANDERSON
  • Publication number: 20090027057
    Abstract: An electrometer includes an input terminal adapted to receive an input signal an ethernet terminal, a web server, and a microcontroller. The ethernet terminal is adapted to receive an ethernet cable such that electrical power is provided to the ethernet terminal. The web server is in electrical communication with the ethernet terminal, and is adapted to receive a command. The microcontroller is in electrical communication with at least one of the ethernet terminal and the web server, and is adapted to execute the received command.
    Type: Application
    Filed: July 26, 2007
    Publication date: January 29, 2009
    Inventors: John T. Anderson, Patrick DeLurgio, Randy Alkire, Michael Molitsky
  • Patent number: 7222082
    Abstract: A business volume and workforce requirements forecaster includes a business structure, a forecast structure, certain hierarchical levels which map to corresponding levels in the business structure, a volume forecaster which forecasts business volume responsive to historical data and to the business and forecast structures, and a workforce requirements engine which forecasts workforce requirements responsive to the forecast business volume. Business volume is forecast for a predefined duration, responsive to both a first set of historical data, and to the business and forecast structures. Calculation of workforce requirements includes task level consolidation and resource leveling, and can include dynamic standard assignment, wherein different metrics are selected at different times, and where a task is associated with a plurality of standards. An event calendar is defined, and at least one event is selected from the calendar and considered in the step of forecasting.
    Type: Grant
    Filed: August 28, 2000
    Date of Patent: May 22, 2007
    Assignee: Kronos Technology Systems Limited Partnership
    Inventors: Chandan Adhikari, John T. Anderson, Mark E. Bucci, Paul J. Piccolomini, Dennis H. Smith, Joseph A. Velazquez
  • Patent number: 6990900
    Abstract: A method and apparatus for stretching and mounting a screen printing screen or mesh that separates the tensioning of the screen/mesh into two independent directions with the screen/mesh attached to two separate independent frames. The outer frame has two ends perpendicular to a print direction for attaching to ends of a screen mesh. The outer frame is placed outside of the inner frame, and supports the screen/mesh tensioned in the print direction of movement, with a high level of tension. The inner frame has two sides parallel to a print direction for attaching to the sides of the screen/mesh. The sides of the inner frame can apply tension, when applicable, to the screen/mesh, at a significantly lower tension level in the non-print direction, can act as, or provide a fixing point for barriers to stop the leakage or loss of the print medium or ink from the screen.
    Type: Grant
    Filed: October 17, 2003
    Date of Patent: January 31, 2006
    Inventor: John T. Anderson
  • Patent number: 6872278
    Abstract: An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from ?20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: March 29, 2005
    Assignee: H.B. Fuller Licensing & Financing, Inc.
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Publication number: 20040003892
    Abstract: An adhesive composition that includes a) an emulsion that includes a multi-stage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Application
    Filed: July 8, 2002
    Publication date: January 8, 2004
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Publication number: 20040003893
    Abstract: An adhesive composition that includes a) an emulsion that includes a multistage polymer that includes a first stage polymer having a Tg from −20° C. to 90° C. and including from about 0.5% by weight to about 3% by weight latent crosslinking monomer based on the first stage monomer weight, and a second stage polymer having a Tg from 40° C. to 140° C., the second stage polymer being different from the first stage polymer, b) formaldehyde-based crosslinking agent, and c) catalyst, the composition being capable of passing the DIN EN 204 Test Method.
    Type: Application
    Filed: September 26, 2002
    Publication date: January 8, 2004
    Inventors: Nicholas C. Lehman, Scott W. Rhein, John T. Anderson
  • Patent number: 5552370
    Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.
    Type: Grant
    Filed: January 18, 1994
    Date of Patent: September 3, 1996
    Assignee: Hewlett-Packard Company
    Inventors: John T. Anderson, V. K. Nagesh, Richard C. Ruby
  • Patent number: 5338507
    Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.
    Type: Grant
    Filed: August 29, 1991
    Date of Patent: August 16, 1994
    Assignee: Hewlett-Packard Company
    Inventors: John T. Anderson, V. K. Nagesh, Richard C. Ruby
  • Patent number: 5198412
    Abstract: A process is disclosed for producing superconductor films on a variety of substrates, and more particularly a patterned superconductor film on a planar substrate. The basic process includes the steps of: 1) depositing a metal film of superconductor precursor elements on a substrate; 2) patterning the metal film; and 3) oxidizing the metal film to form a superconductor film. Because the process separates the metal precursor film formation, patterning, and oxidation steps, each of the steps can be individually optimized.
    Type: Grant
    Filed: December 13, 1991
    Date of Patent: March 30, 1993
    Assignee: Hewlett-Packard Company
    Inventors: V. K. Nagesh, John T. Anderson
  • Patent number: 5071826
    Abstract: A method for making metal/ceramic superconductor thick film structures including the steps of preparing a silver/superconductor ink, applying the ink to a substrate, evaporating the ink's binder, decomposing a silver compound in the residue to coat the superconductor grains, sintering the coated superconductor grains, and oxygenating the superconductor grains through the silver coating. The resultant inter-granular silver increases the critical current and mechanical strength of the superconductor.
    Type: Grant
    Filed: October 13, 1989
    Date of Patent: December 10, 1991
    Assignee: Hewlett-Packard Company
    Inventors: John T. Anderson, V. K. Nagesh, Richard C. Ruby