Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: A method for dispensing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: The present invention relates to temperature control elements, spindle assemblies, and wafer processing assemblies. According to one embodiment of the present invention, a wafer processing assembly is provided comprising a rotary spindle assembly, at least one liquid source, a controller, a wafer support, and a wafer processing bowl. The rotary spindle assembly comprises a rotary drive motor, a rotary spindle coupled to the rotary drive motor, a heat regulating element arranged about the rotary spindle, and a heat regulating flange secured to the rotary drive motor. The controller is coupled to the liquid source and a temperature sensor coupled to one or both of the heat regulating element and the heat regulating flange and is programmed to be responsive to a temperature signal generated by the temperature sensor.

Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: A develop process for reduced cycle time and reduced defects in the develop process for semiconductor/IC fabrication is shown. The use of a linear slit scan nozzle provides even distribution of a layer of develop material within an acceptable thickness and uniformity range such that a pre-wet step is not needed to spread the develop material evenly over the surface of a wafer. The use of a whip operation prior to rinsing with DI water significantly reduces develop defects.

Abstract: A method for disposing a flowable substance, such as a flowable photoresist, on a microelectronic substrate. The method can include dispensing a portion of the flowable substance on the microelectronic substrate, receiving an image of at least some of the flowable substance on the microelectronic substrate, and, (with reference to the image), comparing a characteristic of the image with a pre-selected characteristic, or comparing a time required to dispense the portion of the flowable substance with a pre-selected, or both. The method can further include adjusting a characteristic of the dispense process when the image differs from the pre-selected image by at least a predetermined amount, or when the time differs from the pre-selected time by at least a predetermined amount, or both.

Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Abstract: A method is provided for more efficient application of a polymeric coating (e.g., die coat) to a substrate (e.g., wafer) surface. One aspect of the method comprises applying an organic liquid (e.g., organic solvent) to the wafer and spinning it to coat the entire wafer surface prior to the application of die coat. This reduces surface tension on the wafer and reduces the amount of die coat required to achieve a high quality film.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: An apparatus for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.

Abstract: Methods for exhausting coating materials used in the process of spin coating a top surface of a wafer, the wafer having an edge and a bottom surface that is supported and rotated by a rotatable chuck attached by a shaft to a spin motor. The apparatus includes a bowl having an exhausted drain configured to receive excess liquid and vapor from the spin coating and an assembly configured to maintain the drain at a negative pressure differential relative to the bowl. In a preferred embodiment, a baffle is attached to the bottom to limit the flow of the liquid and vapor into the drain to a predetermined direction.