Patents by Inventor John T. Geary

John T. Geary has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin compositions cured with imide-amine at ambient temperatures to afford products having useful properties at high temperatures
    Patent number: 4467100
    Abstract: Imide-amides having the structure ##STR1## wherein ##STR2## are certain cycloaliphatic or aromatic groups and R and R individually are hydrogen, halogen, an alkyl group having from 1 to 4 carbon atoms, hydroxy, carboxyl, and amine and when taken together represent ##STR3## wherein R.sup.2 is the same as R and R.sup.1, have been found to provide cured epoxy resin systems characterized by high temperature stability and excellent mechanical and physical properties.
    Type: Grant
    Filed: July 21, 1982
    Date of Patent: August 21, 1984
    Assignee: Lord Corporation
    Inventors: Raj N. Gounder, John T. Geary
  • Imide-anhydrides and epoxy resin systems containing such compounds
    Patent number: 4366302
    Abstract: Imide-anhydrides having the structure ##STR1## wherein 1 and 2 are certain cycloaliphatic or aromatic groups and Z is selected from certain imide-anhydride and other substituents have been found to provide cured epoxy resin systems characterized by high temperature stability and excellent mechanical and physical properties.
    Type: Grant
    Filed: June 15, 1981
    Date of Patent: December 28, 1982
    Assignee: Lord Corporation
    Inventors: Raj N. Gounder, John T. Geary
  • Epoxy resin compositions cured with imide-amines
    Patent number: 4340715
    Abstract: Imide-amines having the structure ##STR1## wherein ##STR2## are certain cycloaliphatic or aromatic groups and R and R individually are hydrogen, halogen, an alkyl group having from 1 to 4 carbon atoms, hydroxy, carboxyl, and amine and when taken together represent ##STR3## wherein R.sup.2 is the same as R and R.sup.1, have been found to provide cured epoxy resin systems characterized by high temperature stability and excellent mechanical and physical properties.
    Type: Grant
    Filed: May 26, 1981
    Date of Patent: July 20, 1982
    Assignee: Lord Corporation
    Inventors: Raj N. Gounder, John T. Geary