Patents by Inventor John T. Hawton, Jr.

John T. Hawton, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cylindrical magnetron sputtering source
    Patent number: 4179351
    Abstract: Placement of cylindrical magnets inside of a cylindrical cathode comprising a source of depositing material for sputter depositing of the material upon the interior surface of a substantially cylindrical workpiece, results in improved deposition rates, low power requirements, low workpiece temperatures and purity and cohesiveness in the deposited layer of material.
    Type: Grant
    Filed: September 9, 1976
    Date of Patent: December 18, 1979
    Assignee: Hewlett-Packard Company
    Inventors: John T. Hawton, Jr., William G. Shumate