Patents by Inventor John T. Hoback

John T. Hoback has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6462107
    Abstract: Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: October 8, 2002
    Assignee: The Texas A&M University System
    Inventors: David P. Sinclair, Douglas E. Fjare, John T. Hoback, Terre L. VanKirk, Donald E. Rubis, David A. Wargowski, Wen-Feng Liu, Paul A. Sanchez
  • Patent number: 4374214
    Abstract: Resins are obtained from blends of epoxide and imide containing or derived compounds, which have good resistance to mechanical deformation at elevated temperatures and good adhesion to inorganic materials such as metals and ceramics. These resins are particularly useful for making composite materials and molded articles.
    Type: Grant
    Filed: March 3, 1981
    Date of Patent: February 15, 1983
    Assignee: General Electric Company
    Inventors: Fred F. Holub, John T. Hoback