Patents by Inventor John T. Josefosky

John T. Josefosky has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8638114
    Abstract: A wafer test probe for testing integrated circuitry on a die is disclosed. The wafer test probe includes a membrane core. The wafer test probe also includes circuitry within the membrane core. The circuitry within the membrane core includes at least one portion of an inductor. The wafer test probe further includes a probe tip.
    Type: Grant
    Filed: December 8, 2009
    Date of Patent: January 28, 2014
    Assignee: QUALCOMM Incorporated
    Inventors: John T Josefosky, Yiwu Tang, Roger Hayward
  • Publication number: 20110133766
    Abstract: A wafer test probe for testing integrated circuitry on a die is disclosed. The wafer test probe includes a membrane core. The wafer test probe also includes circuitry within the membrane core. The circuitry within the membrane core includes at least one portion of an inductor. The wafer test probe further includes a probe tip.
    Type: Application
    Filed: December 8, 2009
    Publication date: June 9, 2011
    Applicant: QUALCOMM INCORPORATED
    Inventors: John T. Josefosky, Yiwu Tang, Roger Hayward