Patents by Inventor John T. Legg

John T. Legg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6514063
    Abstract: The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling in accordance with the present invention provides a fixture having grooves that receive the filaments of the stent to hold the filaments in place for joining. The joining of all of the filaments can be performed simultaneously by laser welding or injection molding a joint material. The tooling in accordance with the present invention also provides the capability to mold the stent as one piece. The method in accordance with the present invention includes the steps of providing a fixture with internal grooves, placing filaments into the grooves and joining the filaments together.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: February 4, 2003
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Acciai, Richard R. Hall, John T. Legg
  • Publication number: 20010012960
    Abstract: The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling in accordance with the present invention provides a fixture having grooves that receive the filaments of the stent to hold the filaments in place for joining. The joining of all of the filaments can be performed simultaneously by laser welding or injection molding a joint material. The tooling in accordance with the present invention also provides the capability to mold the stent as one piece. The method in accordance with the present invention includes the steps of providing a fixture with internal grooves, placing filaments into the grooves and joining the filaments together.
    Type: Application
    Filed: February 26, 2001
    Publication date: August 9, 2001
    Applicant: International Business Machines Corporation
    Inventors: Michael A. Acciai, Richard R. Hall, John T. Legg
  • Patent number: 6193829
    Abstract: The present invention relates to a method and tooling for forming a stent and the stent so formed. The stent includes filaments of a first material and joints of a second material. The present invention also discloses the above described stent in combination with an angioplasty balloon. The tooling in accordance with the present invention provides a fixture having grooves that receive the filaments of the stent to hold the filaments in place for joining. The joining of all of the filaments can be performed simultaneously by laser welding or injection molding a joint material. The tooling in accordance with the present invention also provides the capability to mold the stent as one piece. The method in accordance with the present invention includes the steps of providing a fixture with internal grooves, placing filaments into the grooves and joining the filaments together.
    Type: Grant
    Filed: January 7, 1999
    Date of Patent: February 27, 2001
    Assignee: International Business Machines Corporation
    Inventors: Michael A. Acciai, Richard R. Hall, John T. Legg
  • Patent number: 4813130
    Abstract: The method and apparatus described in the disclosure utilizes the known technique of extrusion to form a plurality of very small pins, with diameters of 0.020 inch or smaller, in a substrate of electrically nonconductive material. The number of pins is 360 or more, and the electrically conductive material described in the extrusion process is copper. A pin die is formed with the same number and pattern of holes as are in a blank substrate, and it is positioned over an extrusion die with matching orifices that is fixed on an extrusion press. A head die presses the blank substrate firmly on the pin die during the extrusion operation, and when completed, the pins are sheared and the substrate is ejected as a new blank is positioned to repeat the cycle.
    Type: Grant
    Filed: April 23, 1987
    Date of Patent: March 21, 1989
    Assignee: International Business Machines
    Inventors: Donald Fey, John T. Legg, Mark V. Pierson