Patents by Inventor John T. Plewes

John T. Plewes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5210071
    Abstract: A method for forming elongated articles including metallic oxide superconductor material by hydrostatic extrusion at temperatures less than about 800.degree. C., and even at temperatures less than about 450.degree. C. The method includes providing superconductive core material that is substantially free of carbon or organic additives and that has an equivalent density at least about 55% of full density, and enclosing the densified material in a metal container, to become a cladding, prior to extrusion. In a preferred embodiment, the cladding material is a dispersion hardened metal or metal alloy.
    Type: Grant
    Filed: February 27, 1992
    Date of Patent: May 11, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Dominic N. LoIacono, John T. Plewes
  • Patent number: 5167726
    Abstract: Lead inclusion in copper-containing wrought alloys is coming into disfavor due to health and environmental considerations. Machinability, as well as retention of workability properties, associated with lead inclusion are assured by bismuth together with a modifying element, phosphorous, indium or tin, with such modifying element minimizes the workability-precluding embrittlement otherwise associated with bismuth. Fabrication of product dependent upon properties of the large variety of lead-containing alloys is so permitted by use of lead-free material.
    Type: Grant
    Filed: May 15, 1990
    Date of Patent: December 1, 1992
    Assignee: AT&T Bell Laboratories
    Inventors: Dominic N. LoIacono, John T. Plewes
  • Patent number: 5089057
    Abstract: Copper based alloys, e.g. CuNiSnSi are processed by annealing followed by a high level of cold work area reduction then a recrystallization step which is followed by a low level of cold work prior to spinodal aging. The resultant material is isotropically formable while maintaining high yield strength.
    Type: Grant
    Filed: September 17, 1990
    Date of Patent: February 18, 1992
    Assignee: AT&T Bell Laboratories
    Inventor: John T. Plewes
  • Patent number: 4925407
    Abstract: Contacts comprising nickel and a glass-forming additive have electrical contact properties which render them suitable as replacements for gold contacts; disclosed contacts have low contact resistance even after prolonged exposure to an oxidizing ambient. The glass-forming additive is one or several of the elements boron, silicon, germanium, phosphorus, arsenic, antimony, or bismuth, and contacts are readily formed, e.g., as layers on substrates. A crystallographically disordered structure is produced in a contact surface layer at least upon exposure to an oxidizing ambient; alternatively, such desired structure can be produced by ion bombardment and even in the absence of glass-forming additives.
    Type: Grant
    Filed: January 30, 1986
    Date of Patent: May 15, 1990
    Assignee: American Telephone and Telegraph Company
    Inventors: Joachim J. Hauser, John T. Plewes, Murray Robbins
  • Patent number: 4732821
    Abstract: Nickel material comprising controlled amounts of hydrogen has low electrical contact resistance even after prolonged exposure to an oxidizing ambient. When used as a surface layer on an electrically conducting member, such material is suitable as a contact material and represents an inexpensive alternative to gold. And, when prepared in the form of microscopic flakes, such material is suitable for use in electrically conductive inks and adhesives.
    Type: Grant
    Filed: March 25, 1987
    Date of Patent: March 22, 1988
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Joachim J. Hauser, Andreas Leiberich, John T. Plewes, Murray Robbins
  • Patent number: 4518469
    Abstract: A method for electroplating a nickel-antimony alloy comprising from 1-70 weight percent antimony and the balance nickel comprises electroplating the alloy from a solution containing a soluble nickel salt and a soluble mixed antimony alkali metal salt of a polybasic organic acid at a pH in the range of about from 1 to 6. The substrate to be plated is made the cathode and an inert anode is employed.
    Type: Grant
    Filed: August 31, 1984
    Date of Patent: May 21, 1985
    Assignee: AT&T Technologies, Inc.
    Inventors: Sau-Lan L. NG, John T. Plewes, Murray Robbins
  • Patent number: 4428779
    Abstract: Cu-Ni-Sb alloys have been discovered having a two-phase or multiphase state at low levels of antimony, and alloys in such state have high strength, high ductility, and high electrical conductivity. Tensile strengths in the range of 80,000-160,000 psi have been achieved, and electrical conductivity in the range of 30-65 percent of the conductivity of copper.Alloys of the invention can be made by processing involving homogenizing, rapid cooling, cold working, and aging; for maximized electrical conductivity, dual combined steps of cold working and aging are beneficial.
    Type: Grant
    Filed: June 30, 1982
    Date of Patent: January 31, 1984
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: John T. Plewes, Robert W. Tomb
  • Patent number: 4387276
    Abstract: A carbon transmitter utilizes an electrode prepared by in situ reaction between substrate copper and introduced sulfur. Good surface adhesion between the resulting CuS layer and the substrate is assured by use of a two-phase cobalt/copper substrate.
    Type: Grant
    Filed: September 11, 1981
    Date of Patent: June 7, 1983
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: John T. Plewes, Nathaniel R. Quick, Murray Robbins
  • Patent number: 4304600
    Abstract: In the interest of mechanical strength and hardness, metallic bodies desirably contain dispersed particles whose diameter preferably is in the range of 50-10,000 Angstrom. A disclosed method for producing such metallic bodies calls for preparing a solution of mixed salts of elements, removing the solvent, transforming to metallic form, and compacting under pressure. Strength of a resulting metallic body may be further developed by aging and, optionally, cold deformation prior to aging.Use of the disclosed method is indicated especially to produce bodies comprising immiscible elements. For example, when Mo is dispersed in Cu, high strength and electrical conductivity are realized.
    Type: Grant
    Filed: November 1, 1979
    Date of Patent: December 8, 1981
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: John T. Plewes, Murray Robbins, Raymond C. Stoffers
  • Patent number: 4260432
    Abstract: Alloys are disclosed which contain Cu, Ni, Sn, and prescribed amounts of Mo, Nb, Ta, V, or Fe. A predominantly spinodal structure is developed in such alloys by a treatment which requires annealing, quenching, and aging, and which does not require cold working to develop alloy properties. The shape of articles made from such alloys may be as cast, forged, extruded, hot worked, hot pressed, or cold worked. Shaped articles are strong, ductile, and have isotropic formability.
    Type: Grant
    Filed: January 10, 1979
    Date of Patent: April 7, 1981
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: John T. Plewes
  • Patent number: 4247327
    Abstract: Strengthening and hardening of metallic alloys has formerly been effected by inclusion of various metal and metal oxide additives. According to the invention, alloys having face-centered cubic structure are strengthened and hardened by the inclusion of one or several hydrides which are formed upon interstitial diffusion of hydrogen. Inclusion of hydrogen is conveniently effected in a shaped body of an alloy comprising a first and a second, more easily hydrided component by exposure to a hydrogen atmosphere at elevated temperature.Resulting alloys also have essentially scale-free surface, high electrical conductivity, and high creep resistance. Hydrided alloys may be shaped, e.g., into electrical components such as wire and switch elements.
    Type: Grant
    Filed: August 1, 1979
    Date of Patent: January 27, 1981
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: John T. Plewes
  • Patent number: 4174983
    Abstract: A method is disclosed for making a metallic body having desirable magnetic properties. The metallic body is made from an alloy which contains Fe, Cr, and Co and which may also contain one or several additional ferrite forming elements such as, e.g., Zr, Mo, V, Nb, Ta, Ti, Al, Si, or W. According to the disclosed method the alloy is cooled at a rate of at least 60 degrees C. per hour from an initial temperature at which the alloy is in an essentially single phase alpha state to a second temperature which is in a vicinity of 600 degrees C. Subsequently, the alloy is cooled at a second, slower rate to a third temperature which is in the vicinity of 525 degrees C.The disclosed method allows for a relatively broad range of initial temperatures, is relatively insensitive to compositional variations of the alloy, and permits simple reclamation of suboptimally treated parts. As a consequence, the method is particularly suited for large scale industrial production of permanent magnets as may be used, e.g.
    Type: Grant
    Filed: July 13, 1978
    Date of Patent: November 20, 1979
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: Gilbert Y. Chin, Sungho Jin, John T. Plewes, Bud C. Wonsiewicz
  • Patent number: 4142918
    Abstract: Cu-Ni-Sn alloys are of commercial interest in applications which involve shaping by mechanical working of an alloy as well as in casting applications. Disclosed is a method which is particularly beneficial for casting and forging applications, i.e. applications which involve only limited amounts of working or none at all. The disclosed method allows the production of a fine-grained structure in a Cu-Ni-Sn alloy by a thermal treatment which calls for maintaining the alloy at three specified distinct temperature levels for specified time periods. The resulting fine-grained alloy may undergo further processing as may be beneficial, e.g., to develop desired levels of strength and ductility.
    Type: Grant
    Filed: January 23, 1978
    Date of Patent: March 6, 1979
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: John T. Plewes
  • Patent number: 4130421
    Abstract: Cu-Ni-Sn alloys are disclosed which are particularly suited to undergo shaping by machining such as drilling, and lathing. In addition to Cu, Ni, and Sn, these alloys contain specified small amounts of Te, Se, Pb, or MnS. When articles are formed by machining of alloys having such specified composition, clogging of the machining tool and overheating of workpiece and machining tool are effectively prevented.
    Type: Grant
    Filed: December 30, 1977
    Date of Patent: December 19, 1978
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: John T. Plewes, Philip R. White
  • Patent number: RE30854
    Abstract: Cu-Ni-Sn alloys are disclosed which are particularly suited to undergo shaping by machining such as drilling, and lathing. In addition to Cu, Ni, and Sn, these alloys contain specified small amounts of Te, Se, Pb, or MnS. When articles are formed by machining of alloys having such specified composition, clogging of the machining tool and overheating of workpiece and machining tool are effectively prevented.
    Type: Grant
    Filed: September 22, 1980
    Date of Patent: January 26, 1982
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventors: John T. Plewes, Philip R. White
  • Patent number: RE31180
    Abstract: Copper alloys are disclosed which contain nickel and tin and Fe, Zn, Mn, Zr, Nb, Cr, Al, or Mg in amounts within specified limits. When cold worked and aged according to a critical schedule these alloys develop a predominantly spinodal structure which renders them strong as well as ductile. The disclosed alloys are useful, for example, in the manufacture of components of electrical apparatus such as springs, connectors and relay elements.
    Type: Grant
    Filed: July 6, 1981
    Date of Patent: March 15, 1983
    Assignee: Bell Telephone Laboratories, Incorporated
    Inventor: John T. Plewes