Abstract: An apparatus and method for efficiently routing power signals across semiconductor dies. A semiconductor fabrication process (or process) places a first semiconductor die in an integrated circuit and stacks a second semiconductor die vertically adjacent to the first semiconductor die. The process forms multiple backside metal layers vertically adjacent to a backside of a silicon substrate of the second semiconductor die. The process forms a first backside metal layer that includes at least a first power route that forms a rectangle within the first backside metal layer. The process forms a second backside metal layer that includes at least a second power rail that forms an L-shape within the second backside metal layer. The process connects one or more corners of the rectangle of the first power rail to a corresponding corner of a separate power rail of the second backside metal layer that forms an L-shape.

Abstract: A multipole circuit breaker having a housing with a top wall center recess receiving a center strut of an interior trim. An operating assembly is interconnected with a trip assembly through a transistor link passing beneath the center recess and is operable by the magnetic assembly to assist the operating assembly in separating the breaker contacts in response to a fault current. A closure member overlapped by the interior trim prevents access to the load wires. A voltage reject configuration is provided on the housing to prevent mounting in a panelboard designed to carry voltages higher than that for which the circuit breaker is rated and a jaw assembly for the breaker is disclosed having a plurality of contact positions with each leg of a U shaped bus stab.

Abstract: A multipole circuit breaker having a housing with a top wall center recess receiving a center strut of an interior trim. An operating assembly is interconnected with a trip assembly through a translator link passing beneath the center recess and is operable by the magnetic assembly to assist the operating assembly in separating the breaker contacts in response to a fault current. A closure member overlapped by the interior trim prevents access to the load wires. A voltage reject configuration is provided on the housing to prevent mounting in a panelboard designed to carry voltages higher than that for which the circuit breaker is rated and a jaw assembly for the breaker is disclosed having a plurality of contact positions with each leg of a U shaped bus stab.

Abstract: The following specification describes a bus stab for a panel-board assembly comprising a U shaped bus stab arranged to establish a connection to either a spring clip terminal of a plug-on type circuit breaker or to a bolt-on type terminal of a circuit breaker.

Abstract: A multi-pole circuit breaker includes a wide toggle shaft which spans all of the poles of the breaker and which is electrically neutral. The lower links of the toggle mechanism are made of phenolic or other insulating material which thus electrically insulates the wide toggle shaft spanning all of the poles of the breaker and makes the toggle shaft electrically neutral. A plurality of short toggle springs may therefore be connected between the wide toggle shaft and a handle arm of corresponding width. The plurality of short toggle springs provide as much tripping energy as the longer single or double toggle springs of prior art circuit breakers in which the springs are clustered together in alignment with one pole of the breaker to which they are electrically connected and whose polarity the toggle springs in such prior art breakers accordingly take.