Abstract: A circuit module (10) having enhanced heat transfer and distribution characteristics which is particularly adapted for use in high speed electronic digital computers. The circuit module (10) includes a circuit board assembly (12) with a plurality of electronic devices (26) such as integrated circuits, mounted on a circuit board (28). The circuit board (28) includes conductive pads (42 and 44) and plated-through holes (46) forming a thermally conductive flow path from each electronic device (26) to the opposite side of the circuit board for more efficient heat transfer away from the module (10). The heat pads (42 and 44) and plated-through holes (46) are preferably connected with the ground plane layer (36) of the circuit board (28) for better heat distribution as well.

Abstract: The specification discloses an interconnected multiple circuit module (10) including a connector assembly (14) for interconnecting two circuit modules (12) each having at least one circuit board assembly (16). The connector assembly (14) includes pins (26) extending through the circuit board assemblies (16) and a free connector block (28) for receiving the pins in opposite ends. The pins (26), connector block (28) and contacts (40) within the block are preferably adapted to provide differential mechanical resistances on opposite ends of the block between the pins to facilitate controlled predictable electrical connection of the circuit modules (12).