Abstract: An apparatus and method for an inspection apparatus for inspecting a component. The inspection apparatus including a robotic arm. A micro-XRF instrument having an instrument head coupled to the robotic arm. A seat supporting the component within a scanning area during inspection; and a computer in communication with the robotic arm and the micro-XRF instrument.

Abstract: A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

Abstract: A lens housing includes a main housing, a lens array, a lens housing, and an athermalization bushing. The lens array has a thermally variable focal length that determines a focal point along a focal axis. The lens housing contains the lens array and is situated within the main housing, and is capable of translating relative to the main housing along the focal axis. The athermalization bushing is situated axially between the lens housing and the main housing, such that thermal expansion of the athermalization bushing translates the lens housing along the focal axis. This translation causes the focal point to remain substantially fixed relative to the main housing as the focal length of the lens array varies across an operational temperature range.

Abstract: A multi-tiered approach to combating reverse engineering of electronics is disclosed herein. The encapsulant utilized with the optical sensor may be selected based on being substantially being opaque to X-ray inspection. In this way, visible public inspection to gain competitive intelligence may be reduced and operation of the electronics may remain unaffected. Additionally, a thin filament of wire embedded just below the surface of the encapsulant could be used as an electronic tripwire in response to being severed and/or dissolved by the reverse engineering strong solvents and acids.

Abstract: Provided is an electromagnetic radiation wavelength conversion module for a SLR camera body. The module can include a housing with a first end that can be releasably coupled to the SLR camera body and a second end that can be releasably coupled to a SLR lens. The module can also include an IR sensor disposed in the housing for converting an infrared radiation signature of an object into at least one digital signal and a display disposed within the module for rendering the at least one digital signal into a visible representation of the of the object that can be detected by a sensor of the SLR camera.

Abstract: A method and structure of an image sensor device including a read out integrated circuit (ROIC) and a photodiode array (PDA). An embodiment may include a package substrate having a recess and a raised pedestal within the recess; a read out integrated circuit (ROIC) physically attached to the raised pedestal; a photodiode array (PDA) physically attached to the ROIC and electrically coupled therewith; and a printed circuit board (PCB) within the recess in the package substrate, wherein the PCB has an opening therein and the raised pedestal at least partially extends through the opening in the PCB.