Abstract: Embodiments of the invention may provide a system for the production of photovoltaic modules that comprises at least a first work line having a plurality of positioning stations in which a series of first processing operations are performed and a second work line consisting of at least a positioning station in which at least a second processing operation is performed. The process sequence may include, for example, printing a layer material used to form one or more electric contacts on a base layer, and then positioning photovoltaic cells and various layers of insulating material in a desired orientation over the base layer to form a photovoltaic module.

Abstract: Embodiments of the invention generally relate to a busing sub-assembly and methods of forming photovoltaic modules having busing sub-assemblies. The busing sub-assembly generally includes a carrier backsheet and a plurality of conductive ribbons coupled to the carrier backsheet. An electrically insulating cover is disposed over the conductive ribbons and the carrier backsheet. The ends of each conductive ribbon remain exposed for making an electrical connection to the conductive foil or a junction box. Methods of forming photovoltaic modules generally include positioning a flexible backsheet having an opening therethrough and a conductive foil thereon on a support. A busing sub-assembly is disposed on the flexible backsheet over the opening and in electrical contact with the conductive foil. The busing sub-assembly includes the components necessary to bus electrical current from a plurality of solar cells to a junction box, and can be applied to a photovoltaic module in a singe process step.

Abstract: Embodiments of the invention generally include a method of forming a low cost flexible substrate having one or more conductive elements that are used to form a low resistance current carrying path used to interconnect a plurality of solar cell devices disposed in a photovoltaic module. A surface of the one or more conductive elements will generally comprise a plurality of patterned electrical contact regions that are used to form part of the electrical circuit that interconnects the plurality of solar cell devices. The plurality of electrical contact points form an electrical circuit that has a lower series resistance versus conventional designs. Embodiments may also include a method and apparatus that form the electrical contact regions on an inexpensive conductive material before electrically connecting the anode or cathode regions of a formed solar cell to the conductive material.

Abstract: Embodiments of the invention generally relate to methods of forming flexible substrates for use in photovoltaic modules. The methods include shaping a metal foil and adhering the metal foil to a flexible backsheet. An optional interlayer dielectric and anti-tarnish material may then be applied to the upper surface of the shaped metal foil disposed on the flexible backsheet. The metal foil may be shaped using die cutting, roller cutting, or laser cutting techniques. The die cutting, roller cutting, and laser cutting techniques simplify the flexible substrate formation processes by eliminating resist-printing and etching steps previously used to pattern metal foils. Additionally, the die cutting, roller cutting, and laser cutting techniques reduce the consumption of consumable materials previously used in the patterning of metal foils.

Abstract: Embodiments of the invention generally relate to conductive foils having multiple layers for use in photovoltaic modules and methods of forming the same. The conductive foils generally include a layer of aluminum foil having one or more metal layers with decreased contact resistance disposed thereon. An anti-corrosion material and a dielectric material are generally disposed on the upper surface of the metal layer. The conductive foils may be formed on a carrier prior to construction of a photovoltaic module, and then applied to the photovoltaic module as a conductive foil assembly during construction of the photovoltaic module. Methods of forming the conductive foils generally include adhering an aluminum foil to a carrier, removing native oxides from a surface of the aluminum foil, and sputtering a metal onto the aluminum foil. A dielectric material and an anti-corrosion material may then be applied to the upper surface of the sputtered metal.

Abstract: Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

Abstract: Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

Abstract: Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.