Patents by Inventor John Terpsma

John Terpsma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10925196
    Abstract: The description relates to devices, such as computing devices that can include dimensionally-constrained shielded circuit board assemblies. One example can include a circuit board that includes an upwardly extending fence. The example can also include a heat generating component positioned within the fence and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module can include a downwardly extending frame that overlaps with the fence. The gasket can be compressed between the fence and the frame in a direction parallel to the major planar surface.
    Type: Grant
    Filed: August 9, 2019
    Date of Patent: February 16, 2021
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Todd David Pleake, John Terpsma, Ketan Shah, David Carter Vandervoort, Keith Walter Kaatz
  • Publication number: 20210045264
    Abstract: The description relates to devices, such as computing devices that can include dimensionally-constrained shielded circuit board assemblies. One example can include a circuit board that includes an upwardly extending fence. The example can also include a heat generating component positioned within the fence and a thermal module defining a major planar surface positioned over the heat generating component. The thermal module can include a downwardly extending frame that overlaps with the fence. The gasket can be compressed between the fence and the frame in a direction parallel to the major planar surface.
    Type: Application
    Filed: August 9, 2019
    Publication date: February 11, 2021
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Todd David Pleake, John Terpsma, Ketan Shah, David Carter Vandervoort, Keith Walter Kaatz
  • Patent number: 9448591
    Abstract: Compliant supports hover a battery above pressure sensitive adhesive (PSA) when testing a computing device and before the battery is bonded to an enclosure. The compliant supports are placed along a surface of the enclosure such that at least a portion of each of the compliant supports extends above the PSA. The compliant supports apply an upwards force on the battery to maintain a gap between the battery and the PSA. After electrical testing of the computing device, the battery is brought into contact with the PSA while retaining at least one of the compliant supports in the enclosure. In some embodiments, a downwards force is applied to the battery to overcome the upwards force from the compliant supports.
    Type: Grant
    Filed: February 21, 2014
    Date of Patent: September 20, 2016
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Eric M. Leong, John Terpsma
  • Publication number: 20150241923
    Abstract: Compliant supports hover a battery above pressure sensitive adhesive (PSA) when testing a computing device and before the battery is bonded to an enclosure. The compliant supports are placed along a surface of the enclosure such that at least a portion of each of the compliant supports extends above the PSA. The compliant supports apply an upwards force on the battery to maintain a gap between the battery and the PSA. After electrical testing of the computing device, the battery is brought into contact with the PSA while retaining at least one of the compliant supports in the enclosure. In some embodiments, a downwards force is applied to the battery to overcome the upwards force from the compliant supports.
    Type: Application
    Filed: February 21, 2014
    Publication date: August 27, 2015
    Applicant: Microsoft Corporation
    Inventors: Eric M. Leong, John Terpsma