Abstract: A silicone-free thermal interface for placement along a thermal dissipation pathway is provided for long-term durability. The thermal interface is formed from a multi-part composition and cured in place to obtain a conformable coating with low durometer hardness, which is maintained by a non-crosslinked diluent product formed from a reactive diluent system.

Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Abstract: A thermally conductive curable composition includes a first part and a second part, wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water, and the second part comprises a silyl modified reactive polymer, a low volatile organic liquid, and the ceramic filler mixture, and the low volatile organic liquid is present in the composition in an amount greater than about 50 wt. % based on the total weight of the silyl modified reactive polymer.

Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Abstract: An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.

Abstract: A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.

Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.

Abstract: A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.

Abstract: A thermally conductive adhesive for use in connection with heat-generating electronic components includes an unsaturated carbonyl containing compound combined with a thiol containing compound blended with thermally conductive fillers. The adhesive is fully curable with UV light exposure or within 48 hours at room temperature. The combination of the two different cure methods in this adhesive facilitates rapid and energy efficient manufacturing.

Abstract: An integrated method and system for supporting the activity of consultants in organization and management consulting and services projects. The system comprises a server to which are connected consultant and client workstations. Through his workstation and with the method of the invention, the consultant uses the system parameters to assess the management and organization of a client situation and obtain from the system the results to be realized. From his workstation the consultant can also select a solution already used and stored in the system and adapt, if necessary, the solution to the results to be realized. The system automatically stores solutions positively evaluated. The solution information will be reused, as part of the invention by the consultants, the managers and solution owners in the consulting and service provider company.

Abstract: An integrated method and system for supporting the activity of consultants in organization and management consulting and services projects.