Patents by Inventor John Timmerman

John Timmerman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Silicone free thermal interface material with reactive diluent
    Patent number: 12614779
    Abstract: A silicone-free thermal interface for placement along a thermal dissipation pathway is provided for long-term durability. The thermal interface is formed from a multi-part composition and cured in place to obtain a conformable coating with low durometer hardness, which is maintained by a non-crosslinked diluent product formed from a reactive diluent system.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: April 28, 2026
    Assignee: Henkel AG & Co. KGaA
    Inventors: John Timmerman, Yuqiang Qian
  • Thermal interface materials
    Patent number: 12441881
    Abstract: A thermally conductive curable composition includes a first part and a second part, wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water, and the second part comprises a silyl modified reactive polymer, a low volatile organic liquid, and the ceramic filler mixture, and the low volatile organic liquid is present in the composition in an amount greater than about 50 wt. % based on the total weight of the silyl modified reactive polymer.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: October 14, 2025
    Assignee: Henkel AG & Co. KGaA
    Inventors: Chunyong Wu, John Timmerman, Reid Chesterfield, Radesh Jewram
  • EPOXY-BASED COMPOSITION FOR THERMAL INTERFACE MATERIALS
    Publication number: 20250215303
    Abstract: A two-part thermally conductive curable composition exhibits high dispensing rates and cures to a thermally conductive interface material with high thermal reliability, including high fracture toughness and elongation properties. The curable composition employs a combination of multi-functional and mono-functional liquid epoxy resins with low viscosity.
    Type: Application
    Filed: February 10, 2025
    Publication date: July 3, 2025
    Inventors: John Timmerman, Nicholas T. Kamar, Syed Z. Mahdi, Gage Badeau
  • NON-SILICONE THERMAL INTERFACE MATERIAL
    Publication number: 20240279426
    Abstract: A thermally conductive composition includes a non-silicone polymer resin curable in place along a thermal dissipation pathway. The composition exhibits a low density for particular use in weight-sensitive applications that require a thermal conductivity of at least 1.5 W/m*K.
    Type: Application
    Filed: June 2, 2022
    Publication date: August 22, 2024
    Inventors: Yuqiang Qian, Chunyong Wu, John Timmerman, Reid John Chesterfield
  • SILICONE FREE THERMAL INTERFACE MATERIAL WITH REACTIVE DILUENT
    Publication number: 20220328902
    Abstract: A silicone-free thermal interface for placement along a thermal dissipation pathway is provided for long-term durability. The thermal interface is formed from a multi-part composition and cured in place to obtain a conformable coating with low durometer hardness, which is maintained by a non-crosslinked diluent product formed from a reactive diluent system.
    Type: Application
    Filed: June 20, 2022
    Publication date: October 13, 2022
    Inventors: John Timmerman, Yuqiang Qian
  • Thermal interface material with mixed aspect ratio particle dispersions
    Patent number: 11447677
    Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
    Type: Grant
    Filed: June 11, 2019
    Date of Patent: September 20, 2022
    Assignee: Henkel AG & Co. KGaA
    Inventors: John Timmerman, Sanjay Misra
  • THERMAL INTERFACE MATERIALS
    Publication number: 20210388203
    Abstract: A thermally conductive curable composition includes a first part and a second part, wherein the first part comprises a catalyst, a ceramic filler mixture, a low volatile organic liquid, and water, and the second part comprises a silyl modified reactive polymer, a low volatile organic liquid, and the ceramic filler mixture, and the low volatile organic liquid is present in the composition in an amount greater than about 50 wt. % based on the total weight of the silyl modified reactive polymer.
    Type: Application
    Filed: August 27, 2021
    Publication date: December 16, 2021
    Inventors: Chunyong Wu, John Timmerman, Reid Chesterfield, Radesh Jewram
  • Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions
    Publication number: 20190322918
    Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
    Type: Application
    Filed: June 11, 2019
    Publication date: October 24, 2019
    Inventors: John TIMMERMAN, Sanjay MISRA
  • Thermally conductive EMI suppression compositions
    Patent number: 9999158
    Abstract: An interface pad for suppressing electromagnetic and radio frequency radiation includes first and second generally opposing sides which define a thickness therebetween, with the interface pad exhibiting thermal conductivity, electrical resistivity, and a hardness of between 10-70 Shore 00 at 20° C. The interface pad is capable of attenuating electromagnetic and/or radio frequency radiation that is commonly associated with interference of electronic components.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: June 12, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Sanjay Misra, John Timmerman, Kasyap Seethamraju
  • Thermally conductive dielectric interface
    Patent number: 9693481
    Abstract: A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.
    Type: Grant
    Filed: June 20, 2014
    Date of Patent: June 27, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: John Timmerman, Jeremy J. Schmitz, Jeremy L Hammond
  • Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions
    Publication number: 20170158936
    Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
    Type: Application
    Filed: February 16, 2017
    Publication date: June 8, 2017
    Inventors: JOHN TIMMERMAN, SANJAY MISRA
  • Thermal interface material with mixed aspect ratio particle dispersions
    Patent number: 9611414
    Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
    Type: Grant
    Filed: July 11, 2014
    Date of Patent: April 4, 2017
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: John Timmerman, Sanjay Misra
  • Thermal Interface Material with Mixed Aspect Ratio Particle Dispersions
    Publication number: 20160009975
    Abstract: An electron package includes an interface member between an electronic component and a thermal dissipation member. The interface member is highly efficient in transmitting thermal energy and/or suppressing electromagnetic radiation, with a particle filler dispersion including a combination of substantially spherical particles and substantially platelet-shaped particles within dispersion attribute ranges.
    Type: Application
    Filed: July 11, 2014
    Publication date: January 14, 2016
    Inventors: John Timmerman, Sanjay Misra
  • Thermally Conductive Dielectric Interface
    Publication number: 20140374071
    Abstract: A thermally conductive dielectric interface includes a relatively hard polymer base, and a polymer upcoat disposed at first and second sides of the base. The upcoat has an intermediate condition that is relatively soft and facilitates thermal joints with respective components of an electronic assembly. Curing the upcoat layer to a finished condition solidifies such thermal joints.
    Type: Application
    Filed: June 20, 2014
    Publication date: December 25, 2014
    Inventors: John Timmerman, Jeremy J. Schmitz, Jeremy L. Hammond
  • Dual Cure Thermally Conductive Adhesive
    Publication number: 20130042972
    Abstract: A thermally conductive adhesive for use in connection with heat-generating electronic components includes an unsaturated carbonyl containing compound combined with a thiol containing compound blended with thermally conductive fillers. The adhesive is fully curable with UV light exposure or within 48 hours at room temperature. The combination of the two different cure methods in this adhesive facilitates rapid and energy efficient manufacturing.
    Type: Application
    Filed: August 16, 2011
    Publication date: February 21, 2013
    Inventors: John Timmerman, Sanjay Misra