Abstract: A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.

Abstract: An electrically controllable optical lens apparatus makes use of fixed lenses and an active optical element together in a lens enclosure. The enclosure may be a barrel structure that is easily mounted to a camera device having an image sensor. The active optical element, such as a tunable liquid crystal lens, receives an electrical signal from the camera device via electrical conductors integral with the lens enclosure that provide electrical pathways between the active element on the interior of the enclosure and surface contacts on the camera device. The enclosure may be a two-piece structure, and the electrical conductors may be attached to either piece of the structure. The lens enclosure may also be threaded for attachment to the camera device. The electrical conductors may also use spring loaded contact portions or molded interconnect devices.

Abstract: A tele wide module includes a first optics group, a fixed position for the first optics group, a second optics group, a set of predetermined positions for the second optics group, a selector for selecting a first position from the set of predetermined positions, and an image sensor. The first optics group is configured to provide a focus to the image sensor. The focus is based on the selected first position. A method of adjusting a lens configuration selects a first position from a set of positions. Based on the selected position, the method deposes a second lens group in relation to a first lens group. Typically, the position of the first lens group is fixed. Through the first and second lens groups, the method provides an image to an image sensor. The method of some embodiments provides a focused image to the image sensor by using a hyper focal setting.

Abstract: A focus free camera module uses fixed lenses within a housing that are combined with an electrically controllable active optical element, such as a tunable liquid crystal lens. The fixed lenses provide a desired amount of optical power, but the manufacturing tolerances of the module are insufficient to ensure a proper focus of an image on an image sensor. The active optical element is therefore used to compensate for any variations in the optical power to achieve the desired focus. To ensure an effective compensation, the module may be constructed so that, when the variation in optical power due to manufacturing tolerances is at a maximum, the desired focus is achieved when the active optical element is at zero optical power. All other variations may then be compensated by adjusting the active optical element to increase its optical power.

Abstract: A wafer level camera module can be easily connected to a host device via mounting surface contacts. The module includes an electrically controllable active optical element and a flexible printed circuit that provides electrical connection between the optical element and surface conductors on a mounting surface of the module. The surface conductors can be a group of solder balls, and the module can have another group of solder balls that make connection to another electrical component of the module, such as an image sensor. All of the solder balls can be coplanar in a predetermined grid pattern, and all of the components of the device can be surrounded by a housing such that the camera module is an easily mounted ball grid array type package.

Abstract: An electrically controllable optical lens apparatus makes use of fixed lenses and an active optical element together in a lens enclosure. The enclosure may be a barrel structure that is easily mounted to a camera device having an image sensor. The active optical element, such as a tunable liquid crystal lens, receives an electrical signal from the camera device via electrical conductors integral with the lens enclosure that provide electrical pathways between the active element on the interior of the enclosure and surface contacts on the camera device. The enclosure may be a two-piece structure, and the electrical conductors may be attached to either piece of the structure. The lens enclosure may also be threaded for attachment to the camera device. The electrical conductors may also use spring loaded contact portions or molded interconnect devices.

Abstract: An optical module includes a first optics group, a second optics group, and an image sensor, wherein the first optics group and second optics group are configured to provide an image having a focus and a magnification to the image sensor. In some embodiments of the present invention, a first optics assembly includes a first optics group coupled to a threaded portion of a first lead screw so that translation of the first lead screw results in translation of the first optics group along an axis of the first lead screw, a first actuator for rotating the first lead screw; and a first sensing target configured to permit detection of rotation of the first lead screw.

Abstract: A tele wide module includes a first optics group, a fixed position for the first optics group, a second optics group, a set of predetermined positions for the second optics group, a selector for selecting a first position from the set of predetermined positions, and an image sensor. The first optics group is configured to provide a focus to the image sensor. The focus is based on the selected first position. A method of adjusting a lens configuration selects a first position from a set of positions. Based on the selected position, the method deposes a second lens group in relation to a first lens group. Typically, the position of the first lens group is fixed. Through the first and second lens groups, the method provides an image to an image sensor. The method of some embodiments provides a focused image to the image sensor by using a hyper focal setting.

Abstract: An optical module includes a first optics group, a second optics group, and an image sensor, wherein the first optics group and second optics group are configured to provide an image having a focus and a magnification to the image sensor. In some embodiments of the present invention, a first optics assembly includes a first optics group coupled to a threaded portion of a first lead screw so that translation of the first lead screw results in translation of the first optics group along an axis of the first lead screw, a first actuator for rotating the first lead screw; and a first sensing target configured to permit detection of rotation of the first lead screw.

Abstract: A novel micro camera module that is manually adjustable between a close-up mode and an infinite mode includes a lens assembly adjustably mounted within a sleeve that is adjustably mounted into a housing. In a particular embodiment the sleeve includes a channel (cam groove) that is engaged by a plurality of pins fixed to the housing. Further, a biasing member is disposed between the sleeve and the housing such that an upward force will enable the pins to firmly engage the lower portion of the channel. In a more particular embodiment, the channel defines two detents that secure the sleeve into predetermined positions with respect to the housing. In an even more particular embodiment, the channel is sloped such that upon rotation of the sleeve, the distance between the lens assembly and an image capture device is changed. In another particular embodiment, the camera module includes an electrical mode detecting switch that is indicative of the position of the camera module.

Abstract: An improved apparatus for and method of attaching a peripheral electronic component to an electronic system uses spring-urged protrusions to attach the peripheral electronic component to the electronic system without screws or other traditional hardware fasteners. Preferably, the spring-urged protrusions are configured to allow quick and easy installation and removal without the need for tools. Further, the apparatus is preferably configured to use standard mounting holes included in most peripheral electronic components. Therefore, the apparatus does not require costly custom modification for use with a variety of peripheral electronic components. More particularly, the apparatus is preferably electrically conductive to ground the chassis of the peripheral electronic component to the electronic system. In addition, the apparatus uses the spring-urged protrusions to reduce or eliminate the transmission of vibration between the peripheral electronic component and the electronic system.

Abstract: A method and apparatus for mounting a motherboard to a chassis of a personal computer using only a single screw. A number of standoffs snap into the base of the chassis, electrically contacting the chassis. Each standoff includes a projection. The motherboard includes apertures for accepting the projections such that when an ramp and shelf of each projection is aligned with the motherboard, the motherboard is positioned a fixed distance from the chassis. A mounting bracket also includes a number of projections. Apertures provided in the motherboard correspond to the projections of the mounting bracket. The surface of each side of the motherboard surrounding each aperture is plated with an electrically conductive material to form a conductive path between the motherboard and the standoffs and the bracket. The projections of the bracket are inserted into the corresponding apertures in the motherboard. A screw is inserted through a wall of the chassis and into a threaded hole in the bracket.

Abstract: A personal computer chassis having increased reliability, versatility and decreased manufacturing costs. In a first embodiment, a disk drive is installed in the chassis in a first orientation for resting the computer on a desk top or in a second orientation, rotated 90 degrees from the first orientation, for resting the computer on a floor. The chassis is configured to allow interchangeable trim plates. When the trim plate is used as a base plate it has a larger periphery than when used as a side trim plate. In a second embodiment, a disk drive may be installed in the chassis without screws. Spring urged clips allow the disk drive to be easily inserted into the computer chassis, yet provide secure attachment. In a third embodiment, electrical contact is ensured for input/output port covers attached to the rear of the computer chassis. Each cover is made to bend slightly over protrusions on the computer chassis, forcing the cover into firm contact with the protrusions.

Abstract: A telephone headset uses extruded thermoplastic with a pair of embedded steel wires to make the headband and microphone boom. The extrusion is formed by feeding the two wires through the extruding die along with the hot plastic. The two wires serve to stiffen the extrusion and also as electrical conductors. The material is cut to length and joined to earphones, microphones and telephone cable to make the headset; the two wires conduct the sound signals to the earphone distal the telephone cable attachment. The extrusion material retains a twist, which allows for angular adjustment of the earphones. A hinge and spring cant the headphone inward at the bottom for greater comfort, and to adjust the angle to the user's head. In a second embodiment, one of the wires is removed after extrusion to leave a tunnel through the extruded material. Small electrical leads can be passed through the tunnel, and the remaining wire remains as a stiffener.