Patents by Inventor John Torgenson

John Torgenson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230062660
    Abstract: An electronics assembly having a substrate, a heat-conductive body spaced from the substrate, a temperature dependent electronic component mounted on the substrate, and a heating element in thermal contact between the temperature dependent electronic component and the heat-conductive body. Methods of making and using an electronics assembly are also provided.
    Type: Application
    Filed: August 23, 2022
    Publication date: March 2, 2023
    Applicant: AMETEK, INC.
    Inventors: Brian Hoden, Joo-Han Kim, James Sweeney, John Torgenson