Abstract: An improved method and a cassette assembly for protecting electronic components, comprising of a housing that encloses the electronic components disposed over an insulator. The housing also encases a scissor jack component that can move from a first to a second position to enable actuation and unmating of the cassette assembly, such as to a next level of packaging. The housing has an overhang design, having complementary upper openings and lower cable shroud areas for supporting cable connections and for providing heat dissipation relief and EMC containment. Alternate designs provide for other components such as a honey comb screen and an EMC gasket to further enable EMC containment. In addition, other components such as an actuation trap door, a retention feature and card support members or support struts can be added to the design to enable better actuation and provide for an improved structural rigidity.

Abstract: A method and incorporated assembly is provided that can be quickly assembled and disassembled inside side racks used for purpose of housing computer systems. The assembly comprises a plurality of side plates that can be secured to inside rack sides, preferably through flexible flanges, a plurality of top and bottom plates that can be secured to the side plates, and a mid-plate is disposed substantially horizontally between the top and bottom plates. Alternately, the assembly can also comprise at least one rear plate that can be secured to the side plates to provide a third side for the assembly. In one embodiment, the rear plates have openings designed to allow for front to back air flow ventilation. In another embodiment the assembly further comprises at least one divider plate, and preferably a plurality of divider plates, that can be secured to the top and bottom and/or mid-plate(s).

Abstract: An actuation assembly and method is described for a computing environment comprising a main housing and a (first) wedge complementary to the main housing. This wedge is connected to the housing at least partially such that this wedge and the main housing form a unitary housing entity. The wedge is also formed such as to house a lead screw on one of its sides. A plurality of slide mechanisms is also provided. The slide mechanism is connected to opposing sides of the main housing and the wedge. A drive wedge is also provided. The drive wedge is connected to the main housing and the first wedge and formed such that it can be moved from a first position to a second position via a lead screw.

Abstract: An electronic module and a method of assembling the electronic module. A circuit board is connected to a chip substrate by an array of connectors, and a base member is on the side of the circuit board away from the chip substrate and connector array. An elastomeric structure is placed between the circuit board and the base member. The elastomeric structure has voids between a first defining plane adjacent the circuit board and a second defining plane adjacent the base member, with the voids adapted to permit local deformation of elastomeric material in the structure. The method includes applying a compressive force between the circuit board and base member to at least partially compressing the elastomeric structure to improve load equalization on the circuit board.

Abstract: A Land Grid Array structure is enhanced with a flex film interposer that not only provides a Land Grid Array (LGA) electrical connection between a Multi-Chip Module (MCM) and the next level of integration such as a system board, but also provides a reliable means to implement desired Engineering Change (EC) capability as well as a means for decoupling power to ground structure to minimize switching activity effects on the System. The invention as described can be implemented for EC repair, for Capacitive Decoupling or both, using a removable and restorable engineering change plug.

Abstract: In an integrated circuit packaging structure, such as in a SCM, DCM, or MCM, a method and apparatus for increasing heat spreader size and thus thermal performance is disclosed. The packaging structure includes a first substrate; an electronic device operably coupled to a top surface defining the first substrate; a heat spreader having a first surface operably coupled to a top surface defining the electronic device and an opposite second surface in thermal communication with a second substrate; and a frame defining an opening therethrough. The frame is further defined by an inwardly extending ledge configured to allow the heat spreader to extend at least to a peripheral edge defining a perimeter of the first substrate. In an exemplary embodiment, the second substrate includes one of a heat sink, cooling plate, thermal spreader, heat pipe, thermal hat, package lid, or other cooling member.

Abstract: An aligning apparatus comprising: a back plane, the back plane comprising at least one back plane connector; at least one daughter card, the daughter card comprising: a lower edge, the lower edge comprising a scalloped surface proximal to a rear surface of the lower edge, and a ramped surface proximal to a front surface of the lower edge; and a daughter card connector, the daughter card connector configured to be removably connectable to the back plane connector; and at least two guide rails extending from the back plane, the guide rail comprising a rear ramp and a front ramp. A method of aligning a daughter card to a back plane, the method comprising: sliding the daughter card towards the back plane; lifting the front end of the daughter; lifting the back end of the daughter card after lifting the front end of the daughter card; and providing the back end of the daughter card with a degree of freedom to lift and lower in order to align to the back plane, after lifting the back end of the daughter card.

Abstract: Highly effective supported nickel catalysts having finely divided metallic nickel deposited thereon and high specific metal surface areas are obtained by a process wherein a support material is contacted with a nickel soap in an inert hydrocarbon and the resulting nickel-bearing support subsequently subjected to a sulfiding step followed by reductive treatment. The present catalyst compositions are useful as hydrogenation catalysts, particularly for the hydrogenation of fatty materials.

Abstract: Heat transfer and associated surfaces in nuclear reactors are decontaminated by treating the surface with ozone to oxidize acid-insoluble metal oxides to a more soluble state, removing oxidized solubilized metal oxides, and removing other surface oxides using low concentrations of decontaminating reagents. Ozone treatment has been found very effective with alloys having surface metal oxides rendered more easily dissolved by ozone oxidation especially with chromium or chromium-nickel containing alloys.