Patents by Inventor John Trepl II

John Trepl II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220406601
    Abstract: A semiconductor wafer processing method, having: ablating a back side of a semiconductor wafer with a laser ablation process; and etching the back side of the semiconductor wafer with an etching process; wherein the laser ablation process forms a pattern in the back side of the semiconductor wafer; wherein the etching process preserves the pattern in the back side of the semiconductor wafer.
    Type: Application
    Filed: May 23, 2022
    Publication date: December 22, 2022
    Inventors: Sudarsan Uppili, Vipindas Pala, Carl Johnson, Chan Wu, John Trepl II