Patents by Inventor John Tseng

John Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230354946
    Abstract: A heat press includes a handle portion and a curved heat plate. That handle portion may be configured to be grasped by a user, and the curved heat (i.e., having a curved engagement surface) may be configured to engage a heat-activated design implement to transfer a design of the heat-activated design implement to a curved surface of a workpiece. Also disclosed herein, according to various embodiments, is a heat press stand having a curved floor and a hat form for supporting a workpiece (e.g., a hat) during a heat-activated design transfer using the heat press. Associated methods are also disclosed herein.
    Type: Application
    Filed: July 21, 2023
    Publication date: November 9, 2023
    Applicant: Cricut, Inc.
    Inventors: Kristy Lynn Barney, Mitchell Alan Cheever, Yung Tseng Chen, Thomas Crisp, John Douglas Dalton, Michelle Fishberg, Kelton Gubler, Desmond Kavanagh, Hayley Ketch, Tyler Lee, Ildefonso M. Resuello, JR., Norman Stevenson, Grayson Stopp
  • Patent number: 11707104
    Abstract: A heat press includes a handle portion and a curved heat plate. That handle portion may be configured to be grasped by a user, and the curved heat (i.e., having a curved engagement surface) may be configured to engage a heat-activated design implement to transfer a design of the heat-activated design implement to a curved surface of a workpiece. Also disclosed herein, according to various embodiments, is a heat press stand having a curved floor and a hat form for supporting a workpiece (e.g., a hat) during a heat-activated design transfer using the heat press. Associated methods are also disclosed herein.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: July 25, 2023
    Assignee: Cricut, Inc.
    Inventors: Kristy Lynn Barney, Mitchell Alan Cheever, Yung Tseng Chen, Thomas Crisp, John Douglas Dalton, Michelle Fishberg, Kelton Gubler, Desmond Kavanagh, Hayley Ketch, Tyler Lee, Ildefonso M. Resuello, Jr., Norman Stevenson, Grayson Stopp
  • Publication number: 20160020158
    Abstract: The present inventions are related to systems and methods for circuit implementation, and more particularly to systems and methods for securing data in a circuit.
    Type: Application
    Filed: July 21, 2014
    Publication date: January 21, 2016
    Applicant: LSI Corporation
    Inventors: Ramesh C. Tekumalla, John Tseng, Parag Madhani
  • Patent number: D991989
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: July 11, 2023
    Assignee: Cricut, Inc.
    Inventors: Yung Tseng Chen, Thomas Crisp, John Douglas Dalton, Michelle Fishberg, Desmond Kavanagh, Hayley Ketch, Michael Nolan, Ildefonso M. Resuello, Jr., Norman Stevenson, Grayson Stopp
  • Patent number: D991995
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: July 11, 2023
    Assignee: Cricut, Inc.
    Inventors: Yung Tseng Chen, Thomas Crisp, John Douglas Dalton, Desmond Kavanagh, Hayley Ketch, Michael Nolan, Ildefonso M. Resuello, Jr., Norman Stevenson, Grayson Stopp
  • Patent number: D994735
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: August 8, 2023
    Assignee: Cricut, Inc.
    Inventors: Thomas Crisp, Ildefonso M. Resuello, Jr., Yung Tseng Chen, John Dalton, Michael Nolan