Patents by Inventor John U. Knickerbrocker

John U. Knickerbrocker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • FILL HEAD FOR INJECTION MOLDING OF SOLDER
    Publication number: 20080302502
    Abstract: A system, method, and apparatus for injection molding conductive bonding material into a plurality of cavities in a surface are disclosed. The method comprises aligning a fill head with a surface. The mold includes a plurality of cavities. The method further includes placing the fill head in substantial contact with the surface. At least a first gas is channeled about a first region of the fill head. The at least first gas has a temperature above a melting point of conductive bonding material residing in a reservoir thereby maintaining the conductive bonding material in a molten state. The conductive bonding material is forced out of the fill head toward the surface. The conductive bonding material is provided into at least one cavity of the plurality of cavities contemporaneous with the at least one cavity being in proximity to the fill head.
    Type: Application
    Filed: August 12, 2008
    Publication date: December 11, 2008
    Applicant: International Business Machines Corp.
    Inventors: STEVEN A. CORDES, Peter A. Gruber, John U. Knickerbrocker, James L. Speidell