Abstract: A 3-D LADAR imaging system incorporating stacked microelectronic layers is provided. A light source is imaged upon a target through beam shaping optics. Photons reflected from the target are collected and imaged upon a detector array though collection optics. The detector array signals are fed into a multilayer processing module wherein each layer includes detector signal processing circuitry. The detector array signals are amplified, compared to a user-defined threshold, digitized and fed into a high speed FIFO range bin. Dependant on the value of the digit contained in the bins in the register, and the digit's bin location, the time of a photon reflection from a target surface can be determined. A T0 trigger signal defines the reflection time represented by each bin location by resetting appropriate circuitry to begin processing.

Abstract: A 3-D LADAR imaging system incorporating stacked microelectronic layers is provided. A light source is imaged upon a target through beam shaping optics. Photons reflected from the target are collected and imaged upon a detector array though collection optics. The detector array signals are fed into a multilayer processing module wherein each layer includes detector signal processing circuitry. The detector array signals are amplified, compared to a user-defined threshold, digitized and fed into a high speed FIFO range bin. Dependant on the value of the digit contained in the bins in the register, and the digit's bin location, the time of a photon reflection from a target surface can be determined. A T0 trigger signal defines the reflection time represented by each bin location by resetting appropriate circuitry to begin processing.