Patents by Inventor John V. Palladino

John V. Palladino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer printed circuit board formation
    Patent number: 5073456
    Abstract: Multilayer printed circuit boards having a number of through-holes are formed employing intermediate layers in bonding copper circuitry to an insulating layer.
    Type: Grant
    Filed: December 5, 1989
    Date of Patent: December 17, 1991
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: John V. Palladino