Abstract: Methods and apparatus for multi-sensor determination of a state of semiconductor equipment are provided In some embodiments disclosed herein, semiconductor manufacturing equipment may include: a plurality of sensors comprising one or more spatial sensors, one or more spectral sensors, and one or more temporal sensors disposed about the semiconductor manufacturing equipment; and a controller communicatively coupled to the plurality of sensors, the controller configured to cause: determining a set of signals, from the plurality of sensors, to monitor during a process to be performed by the semiconductor manufacturing equipment; during the process, obtaining measurements associated with the set of signals from the plurality of sensors; and determining an indication of a state of the semiconductor manufacturing equipment based on a combination of data generated from the measurements associated with the set of signals.

Abstract: An apparatus for positioning a work piece along a Z-axis includes a base having a depression with an open top in it forming a chamber. A cover member has a rigid central portion and a rigid outer portion coupled with the central portion by an intermediate flexure. The cover member overlies and is secured to the base member at the outer portion of the cover member to close the chamber. Fluid under pressure applied to the chamber is used to move the central portion of the cover member along the Z-axis proportionally to the pressure of fluid applied to the chamber by flexing of the flexure.

Abstract: A method and software is disclosed for evaluating characteristics, such as flatness, of a surface of a sample having an edge, comprising selecting an evaluation area having an area surface and a boundary, at least one portion of which is definable with reference to the edge, and evaluating characteristics of the area surface. Edge-specific evaluation conditions are used with edge-specific metrics to quantify parameters for said evaluation area. A system for evaluating such characteristics comprises a data collection system for generating data values for selected locations on said surface; and a data analyzing system for analyzing data values to determine such characteristics. A data interpolation system may be provided to interpolate data values collected with reference to a first coordinate system for analyzing with reference to a second coordinate system.