Abstract: A system for producing technetium-99m from molybdate-100. The system comprises: a target capsule apparatus for housing a Mo-100-coated target plate; a target capsule pickup apparatus for engaging and delivering the target cell apparatus into a target station apparatus; a target station apparatus for receiving and mounting therein the target capsule apparatus. The target station apparatus is engaged with a cyclotron for irradiating the Mo-100-coated target plate with protons. The irradiated target capsule apparatus is transferred to a receiving cell apparatus comprising a dissolution/purification module for receiving therein a proton-irradiated Mo-100-coated target plate. A conveyance conduit infrastructure interconnects: (i) the target capsule pickup apparatus with the target station apparatus, (ii) the target station apparatus and the receiving cell apparatus; and (iii) the receiving cell apparatus and the dissolution/purification module.

Abstract: A system for producing technetium-99m from molybdate-100. The system comprises: a target capsule apparatus for housing a Mo-100-coated target plate; a target capsule pickup apparatus for engaging, and delivering the target cell apparatus into a target station apparatus; target station apparatus for receiving and mounting therein the target capsule apparatus. The target station apparatus is engaged with a cyclotron for irradiating the Mo-100-coated target plate with protons. The irradiated target capsule apparatus is transferred to a receiving cell apparatus comprising a dissolution/purification module for receiving therein a proton-irradiated Mo-100-coated target plate. A conveyance conduit infrastructure interconnects: (i) the target capsule pickup apparatus with the target station apparatus, (ii) the target station apparatus and the receiving cell apparatus; and (iii) the receiving cell apparatus and the dissolution/purification module.

Abstract: The present application is in the field of imaging reagents. In particular, the present application relates to labelled fluorocarbon imaging reagents, the preparation of the reagents, and their uses for imaging such as PET scanning.

Abstract: A system for producing technetium-99m from molybdate-100. The system comprises: a target capsule apparatus for housing a Mo-100-coated target plate; a target capsule pickup apparatus for engaging, and delivering. the target cell apparatus into a target station apparatus target station apparatus for receiving and mounting therein the target capsule apparatus. The target station apparatus is engaged with a cyclotron for irradiating the Mo-100-coated target plate with protons. The irradiated target capsule apparatus is transferred to a receiving cell apparatus comprising a dissolution/purification module for receiving therein a proton-irradiated Mo-100-coated target plate. A conveyance conduit infrastructure interconnects: (i) the target capsule pickup apparatus with the target station apparatus, (ii) the target station apparatus and the receiving cell apparatus, and (iii) the receiving cell apparatus and the dissolution/purification module.

Abstract: A system for producing technetium-99m from molybdate-100. The system comprises: a target capsule apparatus for housing a Mo-100-coated target plate; a target capsule pickup apparatus for engaging and delivering the target cell apparatus into a target station apparatus; a target station apparatus for receiving and mounting therein the target capsule apparatus. The target station apparatus is engaged with a cyclotron for irradiating the Mo-100-coated target plate with protons. The irradiated target capsule apparatus is transferred to a receiving cell apparatus comprising a dissolution/purification module for receiving therein a proton-irradiated Mo-100-coated target plate. A conveyance conduit infrastructure interconnects: (i) the target capsule pickup apparatus with the target station apparatus, (ii) the target station apparatus and the receiving cell apparatus; and (iii) the receiving cell apparatus and the dissolution/purification module.

Abstract: The present application relates to photoacoustic agents, to kits comprising such photoacoustic agents and to uses thereof such as in methods for detecting a presence of a target in a subject. The photoacoustic agents comprise a photoacoustically active moiety (for example, a near infrared dye) that is coupled to a first bioorthogonal reactive group and optionally a targeting entity for a target that is coupled to a second bioorthogonal reactive group.

Abstract: The present application is in the field of imaging reagents. In particular, the present application relates to labelled fluorocarbon imaging reagents, the preparation of the reagents, and their uses for imaging such as PET scanning.

Abstract: A process for producing a hardened target plate coated with a molybdenum-100 metal, comprising the steps of: (i) suspending and intermixing a refined molybdenum-100 metal powder having grain sizes of less than about 10 microns, and a binder, in a polar organic solvent; (ii) inserting into the molybdate-100 mixture, a cathode plate comprising a transition metal and an anode plate comprising conductive metal; (iii) applying a potential from about 300 V to about 1,300 V to the anode plate and cathode plate; (iv) recovering the cathode plate from the molybdate-100 mixture; and (v) sintering the cathode plate at a temperature from a range of about 1,200° C. to about 1,900° C. for a period of time from about 3 h to about 8 h.

Abstract: A system for producing technetium-99m from molybdate-100. The system comprises: a target capsule apparatus for housing a Mo-100-coated target plate; a target capsule pickup apparatus for engaging and delivering the target cell apparatus into a target station apparatus; a target station apparatus for receiving and mounting therein the target capsule apparatus. The target station apparatus is engaged with a cyclotron for irradiating the Mo-100-coated target plate with protons. The irradiated target capsule apparatus is transferred to a receiving cell apparatus comprising a dissolution/purification module for receiving therein a proton-irradiated Mo-100-coated target plate. A conveyance conduit infrastructure interconnects: (i) the target capsule pickup apparatus with the target station apparatus, (ii) the target station apparatus and the receiving cell apparatus; and (iii) the receiving cell apparatus and the dissolution/purification module.

Abstract: Novel ultrasound contrast agents are provided which are covalently linked to a bioorthogonal reactive group, and optionally further coupled to a corresponding bioorthogonal reactive group coupled with a targeting entity. Methods for targeted ultrasound imaging using such contrast agents are also provided comprising the steps of: 1) injecting the contrast agent into a patient and imaging the patient at a site of interest to detect the contrast agent, wherein the detection of the contrast agent indicates the presence of a target within the patient.

Abstract: The present application relates to methods of preparing radiohalogenated compounds, to compounds useful in such methods and to radiohalogenated compounds useful for imaging and/or therapy.

Abstract: A radiolabelled insulin analogue is provided. The analogue comprises a radiolabel linked to an insulin analogue at an amino acid at the terminal end of the B chain of the insulin analogue.

Abstract: The application describes a method of radiolabeling a molecule comprising reacting the molecule and a radionuclide labeling reagent in an emulsion, such as an oil-in-water emulsion.

Abstract: One aspect of the invention relates to complexes of technetium (Tc) and rhenium (Re) with various heteroaromatic ligands, e.g., quinolinyl and isoquinolinyl ligands, and their use in fluoresence and radioimaging for a variety of clinical diagnostic applications, as well as radiopharmaceuticals for therapeutic applications. Another aspect of the invention relates to quinolinyl and isoquinolinyl ligands that form a portion of the aforementioned complexes. Methods for the preparation of the technetium and rhenium complexes are also described. Another aspect of the invention relates to quinolinyl and isoquinolinyl ligands based on derivatized lysine, alanine and bis-amino acids for conjugation to small peptides by solid phase synthetic methods. Additionally, the invention relates to methods for imaging regions of a mammal using the complexes of the invention.

Abstract: The present invention relates to a method of preparing metal-carborane complexes comprising reacting a salt of the formula: [M(CO)3(Xm)3](1+3m), wherein M is selected from a radioisotope of rhenium (Re), technetium (Tc) and any other radioisotope binding in the same fashion, X is the same of different and is, independently, any suitable ligand and m is the formal charge for ligand X, with a nido-carborane or a closo-carborane in the presence of a hard base. In an embodiment of the invention, the hard base is a source of fluoride. Such a method is useful for preparing complexes suitable for radioimaging and radiotherapy.

Abstract: A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.

Abstract: A reliable, inexpensive “back side” thinning process and apparatus therefor, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.

Abstract: A reliable, inexpensive “back side” thinning process, capable of globally as well as locally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip or wire-bond packaged die is mounted on a thinning/polishing tool with the backside accessible. The thinning/polishing tool can be a lapping machine used for global thinning, or a mini milling machine, laser, FIB, or E-beam machine for local thinning. The thickness of the die is measured at at least five locations on the die before thinning. The thinning tool removes silicon on the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy.

Abstract: A reliable, inexpensive “back side” thinning process, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.

Abstract: A reliable, inexpensive “back side” thinning process, capable of globally thinning an integrated circuit die to a target thickness of 10 microns, and maintaining a yield of at least 80%, for chip repair and/or failure analysis of the packaged die. The flip-chip packaged die is exposed at its backside and mounted on a lapping machine with the backside exposed. The thickness of the die is measured at at least five locations on the die. The lapping machine grinds the exposed surface of the die to a thickness somewhat greater than the target thickness. The exposed surface of the die is polished. The thickness of the die is again measured optically with high accuracy. Based on the thickness data collected, appropriate machine operating parameters for further grinding and polishing of the exposed surface are determined. Further grinding and polishing are performed. These steps are repeated until the target thickness is reached.