Abstract: A topical composition for treating genital herpes includes dimethyl sulfoxide (DMSO), a diluent, and a quaternary ammonium compound. The topical composition may further contain a cannabinoid component, such as CBD, and/or a terpene and/or an essential oil. The topical composition may be in the form of a two-component composition in which a first topical composition includes dimethyl sulfoxide (DMSO), a diluent, and a quaternary ammonium compound and the second topical composition includes dimethyl sulfoxide (DMSO), a diluent, and a cannabinoid component.

Abstract: A means and method to utilize government-issued food stamp credit to purchase items from a vending machine. The food stamp credit is to be received through a monetary device and validated through the vending machine control network. The network will validate the transaction and allow or limit the type of purchases based on information collected from the food stamp government program rules and regulations. The invention is applicable to any electronic benefit transfer (EBT) type program or analogous transactions.

Abstract: An apparatus, method, and system of dispensing a row of inventory by advancing the row forward. An elongated member has opposite ends, either of which can receive and mount an actuator, e.g. electric motor. A drive member, e.g. a lead screw, extends along the elongated member and is connectable to the actuator. A push member, e.g. plate, linearly moves along the elongated body in response to the drive member. The assembly is highly adjustable. In one aspect, it is self-contained and can be mounted and adjusted in different positions on a support such as a tray, shelf, or frame. In another aspect, it can be selectively configured between different states. One state has the elongated member mounted in the support in one way, with the actuator at the back and the push member extending laterally in a first direction. In another state, the push member extends laterally an opposite direction.

Abstract: An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chips provide an interface between a power supply and power pads on the product chips, at least one voltage regulator for each product chip. The voltage regulators provide a specified Vdd voltage to the product chips, whereby the Vdd voltage is substantially independent of current drawn by the product chips. The voltage regulators or other electronic means limit current to any product chip if it has a short. The voltage regulator circuit may be gated and variable and it may have sensor lines extending to the product chip. The test chips can also provide test functions such as test patterns and registers for storing test results.

Abstract: An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chips provide an interface between a power supply and power pads on the product chips, at least one voltage regulator for each product chip. The voltage regulators provide a specified Vdd voltage to the product chips, whereby the Vdd voltage is substantially independent of current drawn by the product chips. The voltage regulators or other electronic means limit current to any product chip if it has a short. The voltage regulator circuit may be gated and variable and it may have sensor lines extending to the product chip. The test chips can also provide test functions such as test patterns and registers for storing test results.

Abstract: Selective electrical connections between an electronic component and a test substrate are made using an electrical conductive material. The conductive material of the present invention is a dissolvable material, allowing for rework and repair of a wafer at the wafer-level, and retesting at the wafer-level. In addition, the conductive material may also be used in a permanent package, since the conductive material of the present invention provides complete electrical conductivity and connection between the electronic component and the substrate.

Abstract: An apparatus and a method for simultaneously testing or burning in all the integrated circuit chips on a product wafer. The apparatus comprises a glass ceramic carrier having test chips and means for connection to pads of a large number of chips on a product wafer. Voltage regulators on the test chips provide an interface between a power supply and power pads on the product chips, at least one voltage regulator for each product chip. The voltage regulators provide a specified Vdd voltage to the product chips, whereby the Vdd voltage is substantially independent of current drawn by the product chips. The voltage regulators or other electronic means limit current to any product chip if it has a short. The voltage regulator circuit may be gated and variable and it may have sensor lines extending to the product chip. The test chips can also provide test functions such as test patterns and registers for storing test results.