Abstract: Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In general, the fluid includes first and second chemical substances having different vapor pressures. The apparatus includes an evaporation controller for increasing the evaporation rate of the fluid from the channel into the ambient region, thereby increasing the concentration of the lower vapor pressure (LVP) substance in the portion of the fluid remaining in the channel and increasing the concentration of the higher vapor pressure (HVP) substance in the portion of the fluid evaporated into the ambient region.

Abstract: Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In general, the fluid includes first and second chemical substances having different vapor pressures. The apparatus includes an evaporation controller for increasing the evaporation rate of the fluid from the channel into the ambient region, thereby increasing the concentration of the lower vapor pressure (LVP) substance in the portion of the fluid remaining in the channel and increasing the concentration of the higher vapor pressure (HVP) substance in the portion of the fluid evaporated into the ambient region.

Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Abstract: The present invention provides a bi-directional microelectromechanical element, a microelectromechanical switch including the bi-directional element, and a method to reduce mechanical creep in the bi-directional element. In one embodiment, the bi-directional microelectromechanical element includes a cold beam having a free end and a first end connected to a cold beam anchor. The cold beam anchor is attached to a substrate. A first beam pair is coupled to the cold beam by a free end tether and is configured to elongate when heated thereby to a greater temperature than a temperature of the cold beam. A second beam pair is located on an opposing side of the cold beam from the first beam pair and is coupled to the first beam pair and the cold beam by the free end tether. The second beam pair is configured to elongate when heated thereby to the greater temperature.

Abstract: Apparatus and method for increasing the concentration of a chemical substance in a fluid comprise a micro-fluidic elongated channel formed in a substrate, with the channel being in fluid-flow communication with an ambient region along its elongated dimension. In general, the fluid includes first and second chemical substances having different vapor pressures. The apparatus includes an evaporation controller for increasing the evaporation rate of the fluid from the channel into the ambient region, thereby increasing the concentration of the higher vapor pressure (HVP) substance in the portion of the fluid remaining in the channel and increasing the concentration of the lower vapor pressure (LVP) substance in the portion of the fluid evaporated into the ambient region.

Abstract: In accordance with the invention, a electromechanical optical modulator comprising an optical membrane, a substrate and Fabry-Perot air gap between them is provided with an improved structure for controlling light transmitted into the substrate. Specifically, an etched and coated cavity is formed in the backwall of the substrate underlying the air gap to receive transmitted light and redirect it onto controllable paths within the substrate. Advantageously the substrate is silicon, and the cavity is produced by anisotropic etching.

Abstract: A Mach-Zehnder electro-optic modulator is formed that exhibits significantly reduced chirp by utilizing an RF electrode that covers a first waveguide arm in a first region of the modulator and covers the second, remaining waveguide arm in a third region of the modulator (with a second, intermediate region used as a transition area for the electrode). Moving the electrode from one waveguide to the other allows for the chirp created in the third region to essentially “null out” the chirp that accumulated along the first region. Modulation of the optical signal is maintained in the presence of the “electrode switching” by inverting the domain of the optical substrate material in the third region of the modulator.

Abstract: A Mach-Zehnder electro-optic modulator is formed that exhibits significantly reduced chirp by utilizing an RF electrode that covers a first waveguide arm in a first region of the modulator and covers the second, remaining waveguide arm in a third region of the modulator (with a second, intermediate region used as a transition area for the electrode). Moving the electrode from one waveguide to the other allows for the chirp created in the third region to essentially “null out” the chirp that accumulated along the first region. Modulation of the optical signal is maintained in the presence of the “electrode switching” by inverting the domain of the optical substrate material in the third region of the modulator.

Abstract: A package for hermetically sealing a micro-electromechanical systems (MEMS) device in a hybrid circuit comprise a firewall formed on a substrate for the MEMS device and which has a height defining a cavity of the package in which the MEMS device will be sealed. A second substrate spaced from the first substrate hermetically seals the cavity when the second substrate is flip-chip bonded to the first substrate and soldered to the first substrate with a thin film metal material placed on at least a top portion of the firewall. The resulting firewall MEMS device package can be further packaged using conventional CMOS packaging techniques. By hermetically sealing the cavity, the enclosed MEMS device is protected from deleterious conditions found in the environment of conventional CMOS packaging techniques which is often detrimental to MEMS device function.

Abstract: The specification describes thermo-optically controlled waveguides where the thermo-optic control is a heater strip precisely aligned to the waveguide core by using the heater strip as an etch mask to define at least part of the core/upper cladding structure. In one embodiment the heater strip mask is larger than the underlying waveguide core so as to produce, on etching, a core surrounded with a minimum of cladding material on the sidewalls of the core, and a confined heat channel between the waveguide core and the heater strip. In a second embodiment the heater strip is used as an etch mask to define a core cladding stack, and a third cladding layer is deposited to clad the sidewalls of the core. In this embodiment, the cladding material in the stack can be optimized for thermal conductivity, and the third cladding material can be optimized for thermo-optic sensitivity.

Abstract: An optical signal processing apparatus includes at least two mirror array chips mounted on an upper surface of a base in close proximity to each other to form a compound array. Each mirror array chip includes a substrate, and a plurality of spaced-apart mirrors mounted on an upper surface of the substrate. The mirrors are movable in response to an electrical signal. A plurality of electrical leads for conduct the electrical signals to the mirrors, at least a portion of the electrical leads extending at least partially along the upper surface of the base between a lower surface of the substrate and the upper surface of the base.

Abstract: An apparatus for stabilizing the wavelength of light emitted by a laser or light source comprising a divider for dividing a sample of emitted light into a first and second portion; a first photodetector configured to measure an intensity of the first portion and a second photodetector configured to measure an intensity of the second portion, the second photodetector configured to receive the emitted light via an optical frequency discriminator, such as a dielectric coating, wherein the optical frequency discriminator is configured to modify the intensity of the emitted light at the second photodetector as a function of an optical frequency of the emitted light; and a processor configured to maintain a desired level corresponding to a ratio of the intensity measured by the first photodetector and the intensity measured by the second photodetector, so as to provide a feedback control signal to adjust the wavelength of the emitted light.

Abstract: An improved optical assembly includes a platform which mounts a plurality of optical components operating at multiple wavelengths of light. At least one of the optical components is coated with a filter layer which absorbs stray light generated by the other optical components. The filter layer substantially reduces crosstalk in the optical assembly.

Abstract: A self-orienting optical component advantageous for assembling sub-optical assemblies in which the components must be precisely aligned comprises a component having a magnetic film deposited on a portion of its outer surface so that a magnetic field applied adjacent the optical component will induce the optical component to move to a pre-determined orientation. Advantageously, the optical component also has further layers deposited on portions of its outer surface for aiding in adhesion, soldering, or light transmission. An improved method of assembling an optical subassembly comprises depositing a film of magnetic material over a portion of the outer surface of the optical component and applying a magnetic field to the optical component to induce it to move to a pre-determined orientation to aid in positioning it on a submount.