Patents by Inventor John Vesce, III

John Vesce, III has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional circuit assembly with composite bonded encapsulation
    Patent number: 11277909
    Abstract: The disclosure provides a three-dimensional circuit assembly including a printed circuit board comprising a top film surface and a bottom film surface opposite to the top film surface. The three-dimensional circuit assembly may also include a first layer of a composite material bonded or laminated on the top film surface. The three-dimensional circuit assembly may further include a second layer of the composite material bonded or laminated on the bottom film surface of the printed circuit board.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: March 15, 2022
    Assignee: TTM TECHNOLOGIES INC.
    Inventors: John Vesce, III, Joseph William Heery, Jr.
  • THREE-DIMENSIONAL CIRCUIT ASSEMBLY WITH COMPOSITE BONDED ENCAPSULATION
    Publication number: 20210068250
    Abstract: The disclosure provides a three-dimensional circuit assembly including a printed circuit board comprising a top film surface and a bottom film surface opposite to the top film surface. The three-dimensional circuit assembly may also include a first layer of a composite material bonded or laminated on the top film surface. The three-dimensional circuit assembly may further include a second layer of the composite material bonded or laminated on the bottom film surface of the printed circuit board.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 4, 2021
    Inventors: John Vesce, III, Joseph William Heery, JR.