Abstract: An apparatus for depositing a material onto a substrate under thermally controlled conditions includes an enclosure defining an interior and having an opening, and a deposition device having an orifice and capable of depositing the material onto the substrate. The deposition device is positioned within the interior and the opening allows the orifice to communicate with an environment outside the enclosure. The apparatus further includes a thermal control unit operatively coupled with the enclosure. The thermal control unit includes a vortex tube having an inlet adapted to be coupled with a pressurized gas supply, a cold gas outlet in fluid communication with the interior and adapted to deliver cold gas thereto, and a hot gas outlet also in fluid communication with the interior and adapted to deliver hot gas thereto. The cold and hot gases from the vortex tube are adapted to control the temperature of the deposition device.