Abstract: A slip ring assembly for allowing electrical or electronic signal transfer between a stationary device and a rotating device includes a ring assembly and a brush assembly. The ring assembly comprises a plurality of assembled rings and spacers of selected widths positioned on a longitudinal tube having a slot and a hollow center. The tube may be provided with one or more bearings to allow the tube to be smoothly rotatable in a housing. A plurality of brushes unitarily formed with a plurality of connector pins are held by a brush holder which is removably received in the housing. The connector pins are configured to receive a standard male or female connector. The housing is typically incorporated into a body of a stationary device, and the tube may be attached to or incorporated into a rotating component of an electronic or electrical device.

Abstract: A slip ring assembly for allowing electrical or electronic signal transfer between a stationary device and a rotating device includes a ring assembly and a brush assembly. The ring assembly comprises a plurality of assembled rings and spacers of selected widths positioned on a longitudinal tube having a slot and a hollow center. The tube may be provided with one or more bearings to allow the tube to be smoothly rotatable in a housing. A plurality of brushes unitarily formed with a plurality of connector pins are held by a brush holder which is removably received in the housing. The connector pins are configured to receive a standard male or female connector. The housing is typically incorporated into a body of a stationary device, and the tube may be attached to or incorporated into a rotating component of an electronic or electrical device.

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract: A method of tinning one or more electrical terminals by hot solder dipping is disclosed herein. The process generally involves placing a solder resistant material in a through hole formed in an electrical terminal, and then dipping at least a portion of the terminal into a hot solder. The solder resistant material may include, for example, a titanium or stainless steel wire, and the solder may be a tin-lead solder such as Sn63.

Abstract: There is shown and described a mass flow measuring system for measuring the flow rate of a fluid in a sensing tube over a wide ambient temperature range and with low sensitivity to attitude change. The improvement is directed to the insulating material which is used with the system and the means for producing an isothermal plane around the system.