Abstract: Example features or aspects of the present invention are described in relation to a small, quiet integrated cooling system for an apparatus for testing electronic devices. Characteristics of the test apparatus including a low noise output, low power consumption and a compact size with a small spatial and volume footprint are selected for deployment and use in a an office like environment. The test apparatus comprises a chassis frame and a cooler frame disposed within the chassis frame and thus integrated within the test apparatus, which has a reduced form factor suitable for the in-office deployment. Embodiments offer the ability to maintain the working fluid at a constant temperature.

Abstract: Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.

Abstract: Example features or aspects of the present invention are described in relation to a small, quiet integrated cooling system for an apparatus for testing electronic devices. Characteristics of the test apparatus including a low noise output, low power consumption and a compact size with a small spatial and volume footprint are selected for deployment and use in a an office like environment. The test apparatus comprises a chassis frame and a cooler frame disposed within the chassis frame and thus integrated within the test apparatus, which has a reduced form factor suitable for the in-office deployment.

Abstract: Disclosed herein is a cost effective, efficient, massively parallel multi-wafer test cell. Additionally, this test cell can be used for both single-touchdown and multiple-touchdown applications. The invention uses a novel “split-cartridge” design, combined with a method for aligning wafers when they are separated from the probe card assembly, to create a cost effective, efficient multi-wafer test cell. A “probe-card stops” design may be used within the cartridge to simplify the overall cartridge design and operation.

Abstract: In one embodiment, an interface includes a plurality of test electronics to DUT interfaces. Each test electronics to DUT interface has at least one test electronics interface, at least one DUT interface, and an electrical coupling between the at least one test electronics interface and the at least one DUT interface. First and second subsets of the DUT interfaces are respectively positioned along the perimeters of first and second concentric shapes.

Abstract: In one embodiment, a test system has a set of test electronics for testing a device under test (DUT). The test system also has at least one test electronics to DUT interface having a zero insertion force (ZIF) connector. Each ZIF connector has a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.

Abstract: In one embodiment, a test system has a set of test electronics for testing a device under test (DUT). The test system also has at least one test electronics to DUT interface having a zero insertion force (ZIF) connector. Each ZIF connector has a ZIF connector to DUT clamping mechanism configured to i) apply a first orthogonal force to a probe card that interfaces with a DUT, by pressing the ZIF connector against the probe card, and simultaneously ii) exert at least one second orthogonal force on the probe card, the at least one second orthogonal force being opposite in direction to the first orthogonal force.

Abstract: A paddle board probe card for connecting a device under test with an ATE tester by means of ZIF connectors is presented. The paddle board probe card may include more than one printed circuit board mounted on a probe card in such a manner that the more than one printed circuit boards mate with ZIF connectors on an ATE testhead interface.

Abstract: A paddle board probe card for connecting a device under test with an ATE tester by means of ZIF connectors is presented. The paddle board probe card may include more than one printed circuit board mounted on a probe card in such a manner that the more than one printed circuit boards mate with ZIF connectors on an ATE testhead interface.

Abstract: In one embodiment, a mating circuit assembly is coupled and decoupled to a system by 1) mechanically and electrically coupling at least a first interposer, mounted on at least one of first and second substrates, to the mating circuit assembly. The mechanical and electrical coupling is accomplished using at least first and second spring mechanisms, with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates. At least one of the first and second substrates transmits signals between the first interposer and the system. The first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates. Other embodiments are also disclosed.

Abstract: A thermal chuck or heat sink (10) has a lower surface (12) covered with fins (14) parallel to air flow (16), to increase the surface area and promote heat transfer. A pair of slots (32) near pedestal (20) (along the fins) effectively lowers the conductivity of the metal in the direction across the fins. Heat flowing through this region of lowered conductivity experiences a greater temperature drop. This raises the temperature at the adjacent parts of the top surface, and (for properly sized slots) results in circular isotherms. The circular isotherms are turned into a nearly isothermal surface by a precisely dimensioned groove (36) parallel to the top surface (22), extending around the circumference of the pedestal (20). Heat flowing into the outer regions of the circular surface (22) is forced to travel radially inward, thus raising the edge temperature (which would naturally be lower than the center).