Abstract: Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.

Abstract: A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.

Abstract: A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.

Abstract: Pastes for use in producing sintered frit patterns (14) on glass sheets (12), such as the glass sheets used as covers for OLED (18) display devices (10), are provided. The pastes include glass particles, filler particles, and a vehicle. The sizes of the filler and/or glass particles are reduced compared to prior art pastes. Reductions in porosity and surface roughness of sintered frits produced using the pastes, as well as improvements in the available process window for producing OLED packages and the hermeticity and strength of those packages, are reported.

Abstract: A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.

Abstract: Methods for assembling an optoelectronic device are provided. The optoelectronic device includes a first transparent substrate, a second substrate, and environmentally sensitive components. The methods comprise the step of applying a fill material to a surface of at least one of the substrates, and lowering a viscosity of the fill material. The methods further comprise the step of pressing the first transparent substrate and the second substrate together such that the fill material substantially fills an area between the first transparent substrate and the second substrate and substantially encapsulates exposed portions of the environmentally sensitive components. The methods still further comprise the step of sealing the first transparent substrate and the second substrate together to hermetically seal the fill material within the area.

Abstract: A method is described herein for sintering a frit to a glass plate where the sintered frit and glass plate are subsequently sealed to another glass plate to form a sealed glass package. Examples of the sealed glass package include a light-emitting device (e.g., organic light emitting diode (OLED) device), a photovoltaic device, a food container, and a medicine container.

Abstract: Pastes for use in producing sintered frit patterns (14) on glass sheets (12), such as the glass sheets used as covers for OLED (18) display devices (10), are provided. The pastes include glass particles, filler particles, and a vehicle. The sizes of the filler and/or glass particles are reduced compared to prior art pastes. Reductions in porosity and surface roughness of sintered frits produced using the pastes, as well as improvements in the available process window for producing OLED packages and the hermeticity and strength of those packages, are reported.

Abstract: An apparatus for sealing a glass package by applying a force to a glass assembly while simultaneously irradiating a sealing material disposed between the two glass substrates with a beam of radiation. The applied force is translated in unison with the radiation beam. The radiation cures and/or melts the sealing material, depending upon the sealing material. The applied force beneficially improves contact between the glass substrates and the sealing material during the sealing process, therefore assisting in achieving a hermetic seal between the substrates.

Abstract: A glass package is disclosed comprising a first substrate and a second substrate, where the substrates are attached in at least two locations, both attachments comprising frits, and wherein the frits comprise a glass portion comprising: a base component comprising and at least one absorbing component. Also disclosed is a method of sealing a light emitting display device comprising providing a light emitting layer, a first substrate and a second substrate, where a frits are deposited between the substrates, and where the frits are sealed with a radiation source.

Abstract: The present invention relates to a composition for coating optical fibers that includes an oligomeric component present in an amount of about 15 weight percent or less and a monomeric component present in an amount of about 75 weight percent or more, where the cured product of the composition has a Young's modulus of at least about 650 MPa. When the composition is substantially devoid of the oligomeric component, the monomeric component preferably includes two or more monomers. Also disclosed are the cured products of the compositions of the present invention, optical fibers that contain secondary coatings prepared from the compositions of the present invention, methods of making such optical fibers, as well as fiber optic ribbons containing a matrix prepared from the compositions of the present invention.

Abstract: The present invention relates to an optical fiber ribbon. The optical fiber ribbon includes a plurality of coated, substantially coplanar optical fibers and a ribbon matrix material which maintains the plurality of coated optical fibers in substantially coplanar alignment. Each of the optical fibers includes a glass core, a cladding layer. surrounding and adjacent to the glass core, and a primary polymeric coating material, preferably containing a silicone, surrounding and adjacent to the cladding layer. The primary polymeric coating material adheres to the cladding layer to form a cladding layer-primary polymeric coating material interface. Upon application of a longitudinal stripping force at the cladding layer-primary polymeric coating material interface, the ribbon matrix material and the primary polymeric coating material are substantially removed from the cladding layer.

Abstract: The optical fiber ribbon includes a plurality of coated, substantially coplanar optical fibers and a ribbon matrix material which maintains the plurality of coated optical fibers in substantially coplanar alignment. Each of the optical fibers includes a core, a cladding layer surrounding and adjacent to the core, and a primary polymeric coating material surrounding and adjacent to the cladding layer. The primary polymeric coating material adheres to the cladding layer to form a cladding layer-primary polymeric coating material interface. Upon application of a longitudinal stripping force at the cladding layer primary polymeric coating material interface, the ribbon matrix material and the primary polymeric coating material are substantially removed from the cladding layer leaving a continuous, smooth residual layer of the primary polymeric coating material with a thickness of less than about 5 .mu.m.