Abstract: A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

Abstract: A multi-channel, dual-band, radio frequency (RF) transmit/receive (T/R) module, for an active electronically scanned array, is provided. The module includes a compact, RF manifold connector and at least four T/R channels. Each of the T/R channels includes a notch radiator, a diplexer coupled to the notch radiator, a power amplifier, including at least one dual-band gain stage, coupled to the notch radiator, a low noise amplifier, including at least one lower-band gain stage and at least one upper-band gain stage, coupled to the diplexer, and a T/R cell, including a phase shifter, a signal attenuator and at least one dual-band gain stage, coupled to the power amplifier, the low noise amplifier and the manifold connector.

Abstract: A phased array antenna tile which is steered by microelectromechanical system (MEMS) switched time delay units (TDUs) in an array architecture which reduces the number of amplifiers and circulators needed for implementing an active aperture electronically scanned array antenna so as to minimize DC power consumption, cost and mass of the system, making it particularly adaptable for airborne and spaceborne radar applications.

Abstract: A ridge waveguide filter which is formed of metallized blind vias in a plurality of contiguous layers of a dielectric medium including low temperature cofired ceramic (LTCC), high temperature cofired ceramic (HTCC) or organic printed wiring boards (PWB) in the fabrication of the waveguide sidewalls and solid ground planes to provide top and bottom walls as well as in the formation of a plurality of ridge waveguide sections in an embedded ridge waveguide structure. Patterns of conductive metal are selectively printed on the outer surface of certain dielectric layers to electrically short all the vias in the ridge waveguide sections and the adjacent wall vias so that the elements behave as though they comprise a solid metal structure.

Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.

Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.

Abstract: A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

Abstract: Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high temperature cofired ceramic (HTCC) layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package.

Abstract: A transmit/receive (T/R) module adapted for use in a radar system. The module has a unified structure including a layered substrate on and in which two T/R channel circuits are integrated. The channel circuits make use of power distribution, channel controller, and RF signal routing circuitry, partly on a channel shared basis. In the RF routing circuitry, respective coupler elements are employed to combine RF receive signals for output to an RF receive manifold and to split an RF transmit signal from a transmit manifold into separate RF transmit signals for input to the T/R channel circuits.

Abstract: In a motion insensitive coaxial cylindrical connector a male member has a substantially cylindrical body having a male or diameter and a substantially cylindrical stub having a minor diameter which stub extends from the body of the male member. The stub fits into a dielectric sleeve within a cavity in a female member. Preferably, the dielectric sleeve has two portions made of different dielectric materials.

Abstract: A double sideband suppressed carrier modulator apparatus for combining two serrodyne (i.e., single sideband) modulators to achieve double sideband, suppressed carrier modulation. An RF input signal is divided into two carrier signals which are 90 degrees out of phase and applied to the serrodyne modulator units. The modulated signals from the modulators are combined in a 90 degree power divider to provide a double sideband suppressed carrier modulated output signal.

Abstract: An electronically agile multi-beam radar including a clutter positioning system for positioning the band of clutter signals in the derived doppler frequency spectrum of each of the individual beams is disclosed. The radar is operative to switchedly transmit a plurality of beams directionally separated by time sharing the illuminating power thereof. Each beam includes at least one transmission of a plurality of R.F. pulses constituting a radar look. The radar is also operative to receive echo R.F. pulses of the look from each transmitted beam dispersed in time with echo R.F. pulses of the looks of the other transmitted beams of the plurality.

Abstract: An electrical phase shifting circuit element of the reflection type including a quadrature coupler branch network, a matched pair of selectively coupled transmission lines and an electrical switching element corresponding to each pair of transmission lines, all being separated distributively from each other and a ground plane by a dielectric material, is disclosed. One end of one transmission line of each pair is connected to a corresponding phase splitting port of the quadrature coupler and another end of the other transmission line of each pair is coupled to the switching element which is preferably a pin diode. The pin diodes may be governed by a common switching signal to electrically connect and disconnect the another ends of the other transmission lines to the ground plane.