Patents by Inventor John W. Hart, Jr.

John W. Hart, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Saddle bracket for solid state pressure gauge
    Patent number: 6177727
    Abstract: A semiconductor component (31) and a method for coupling a semiconductor device (36) to a substrate (81). The semiconductor component (31) includes a saddle (34) and the semiconductor device (36). The saddle (34) has a plurality of sides (51, 52, 53, 54, 55) that form a semiconductor device receiving area (58). The semiconductor device (36) is inserted into the semiconductor device receiving area (58) and secured in the semiconductor device receiving area (58) using tabs (66, 67). The saddle (34) is coupled to the substrate (81) by fasteners (82,83).
    Type: Grant
    Filed: May 1, 1998
    Date of Patent: January 23, 2001
    Assignee: Motorola, Inc.
    Inventors: John W. Hart, Jr., William G. McDonald, Daniel John Wallace, Jr.
  • Semiconductor component and method of fabrication
    Patent number: 5918112
    Abstract: A semiconductor component includes a leadframe (10), an electronic component (21) mounted over the leadframe (10), a packaging material (23) around the electronic component (21) and the leadframe (10) wherein the packaging material has a recess (24), another electronic component (30) in the recess (24), and a cap (32) over the recess (24) and the other electronic component (30). The other electronic component (30) is electrically coupled to the electronic component (21) through internal leads (13) and (14) of the leadframe (10). After a dam bar (15) is removed from the leadframe (10), the internal leads (13) are physically and electrically isolated from other portions of the leadframe (10) including the external leads (12) and the flag (11).
    Type: Grant
    Filed: July 24, 1997
    Date of Patent: June 29, 1999
    Assignee: Motorola, Inc.
    Inventors: Mahesh K. Shah, John W. Hart, Jr.
  • Package assembly for an electronic component
    Patent number: 5889658
    Abstract: A package assembly (70) for encapsulating and vertically surface mounting a semiconductor device such as an accelerometer includes a semiconductor device (40), a package (44) enclosing the semiconductor device, and a plurality of leads (16, 18) protruding from the package. The plurality of leads are formed from a common leadframe (10) and an internal portion of a first lead of the plurality of leads is offset from a common plane corresponding to the common leadframe prior to forming any of the plurality of leads. The offset lead increases the rigidity and vibration-resistance of the package assembly.
    Type: Grant
    Filed: November 25, 1997
    Date of Patent: March 30, 1999
    Assignee: Motorola, Inc.
    Inventors: Paul L. Sullivan, Robert W. Kamb, John W. Hart, Jr., David J. Dougherty
  • Pressure sensor built into a cable connector
    Patent number: 5341684
    Abstract: A semiconductor sensor (10) is built into a cable connector to provide rapid and reliable attachment of the semiconductor sensor (10) into a monitoring or control system. The sensor (10) is mounted in a package (11) having cable connector leads (12, 13, 14) extending through the package (11). The semiconductor sensor (10) is electrically attached to the cable connector leads (12, 13, 14). A housing (20,30) surrounds the package (11) and provides a protective shroud for the cable connector leads (12, 13, 14).
    Type: Grant
    Filed: December 7, 1992
    Date of Patent: August 30, 1994
    Assignee: Motorola, Inc.
    Inventors: Victor J. Adams, Sidney H. Griest, John W. Hart, Jr.