Abstract: A connector including a first body, a second body, a dielectric film and one or more conductive traces. The first body has first and second opposite sides and includes an elastomeric absorber material with ferrite or iron powder dispersed therein. The second body includes the elastomeric absorber material with ferrite or iron powder dispersed therein. The dielectric film is disposed on surfaces of the first body to extend along and between the first and second opposite sides. The one or more conductive traces are sandwiched between the second body and the dielectric film to extend along and between the first and second opposite sides. The connector can be installed into a conductive aperture, to channel RF energy through it and thus effecting an absorptive RF filter for a signal.

Abstract: A method of fabricating a printed wiring board (PWB) includes etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer. The first epoxy-based layer includes radio frequency (RF) absorber material. The method also includes arranging a second epoxy-based layer. The second epoxy-based layer includes the RF absorber material and includes a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.

Abstract: A method of fabricating a printed wiring board (PWB) includes etching traces to carry direct current (DC) on a first surface of a first epoxy-based layer. The first epoxy-based layer includes radio frequency (RF) absorber material. The method also includes arranging a second epoxy-based layer. The second epoxy-based layer includes the RF absorber material and includes a first surface in contact with the first surface of the first epoxy-based layer such that the traces are sandwiched between the first epoxy-based layer and the second epoxy-based layer.

Abstract: A connector including a first body, a second body, a dielectric film and one or more conductive traces. The first body has first and second opposite sides and includes an elastomeric absorber material with ferrite or iron powder dispersed therein. The second body includes the elastomeric absorber material with ferrite or iron powder dispersed therein. The dielectric film is disposed on surfaces of the first body to extend along and between the first and second opposite sides. The one or more conductive traces are sandwiched between the second body and the dielectric film to extend along and between the first and second opposite sides. The connector can be installed into a conductive aperture, to channel RF energy through it and thus effecting an absorptive RF filter for a signal.

Abstract: A polarizer apparatus for RF communications including an in-line waveguide switch having a first port with a rectangular waveguide shape, and a second port having a circular waveguide shape. The waveguide switch includes a plurality of rotatable disks coupled and arranged between the input and output of said waveguide switch, each of the disks having an opening provided therein which defines at least a portion of a signal path configured to allow RF signals to propagate therethrough. The waveguide switch includes an actuating mechanism arranged to rotate the disks to positions relative to each other which modify the polarization of RF signals propagating through the openings. The polarizer apparatus includes a feed coupled to the output of the waveguide switch, the feed including a vane polarizer arranged to circularly polarize signals provided thereto from the output of the waveguide switch.

Abstract: A polarizer apparatus for RF communications including an in-line waveguide switch having a first port with a rectangular waveguide shape, and a second port having a circular waveguide shape. The waveguide switch includes a plurality of rotatable disks coupled and arranged between the input and output of said waveguide switch, each of the disks having an opening provided therein which defines at least a portion of a signal path configured to allow RF signals to propagate therethrough. The waveguide switch includes an actuating mechanism arranged to rotate the disks to positions relative to each other which modify the polarization of RF signals propagating through the openings. The polarizer apparatus includes a feed coupled to the output of the waveguide switch, the feed including a vane polarizer arranged to circularly polarize signals provided thereto from the output of the waveguide switch.

Abstract: Embodiments of the invention are directed to a high isolation waveguide switch that can either be manually or mechanically operated. Operation proceeds by loosening a fastener, which draws a rotor portion of the switch away from a stator portion; rotating the rotor by 90 degrees; and tightening the fastener, pushing the rotor into contact with the stator and completing connections to the waveguide ports. Gaskets may provide EMI shielding and ensure port-to-port isolation.

Abstract: Embodiments of the invention are directed to a high isolation waveguide switch that can either be manually or mechanically operated. Operation proceeds by loosening a fastener, which draws a rotor portion of the switch away from a stator portion; rotating the rotor by 90 degrees; and tightening the fastener, pushing the rotor into contact with the stator and completing connections to the waveguide ports. Gaskets may provide EMI shielding and ensure port-to-port isolation.

Abstract: A process for manufacturing a printed wiring board includes specifying overlapping etches for a first portion of the printed wiring board and a second portion of the printed wiring board, the first portion of the printed wiring board having disposed thereon a printed circuit having at least one dimension critical to printed wiring board operation, etching a first conductor in the first portion of the printed wiring board when a first conductor thickness is a predetermined thickness, completing all plating steps, and etching a second conductor in the second portion of the printed wiring board.

Abstract: A process for manufacturing a printed wiring board includes specifying overlapping etches for a first portion of the printed wiring board and a second portion of the printed wiring board, the first portion of the printed wiring board having disposed thereon a printed circuit having at least one dimension critical to printed wiring board operation, etching a first conductor in the first portion of the printed wiring board when a first conductor thickness is a predetermined thickness, completing all plating steps, and etching a second conductor in the second portion of the printed wiring board.