Patents by Inventor John W. Jacobi

John W. Jacobi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for bonding integrated circuit components
    Patent number: 4842662
    Abstract: Tape-automated-bonding (TAB) tape can be directly bonded (i.e., no "gold bumps" are needed) to aluminum bonding pads of integrated circuit devices, without contacting any other part of the integrated circuit device, by use of a process employing the herein disclosed parameters of ultrasonic energy, pressure, time, heat, and relative dimensions of the TAB tape.
    Type: Grant
    Filed: June 1, 1988
    Date of Patent: June 27, 1989
    Assignee: Hewlett-Packard Company
    Inventor: John W. Jacobi