Abstract: An improved test apparatus is disclosed for testing leadless IC chip carriers or IC dies. The apparatus employs a flexible film on which is imprinted a conductor line pattern terminated in a plurality of raised conductive pads. The line pattern is readily formed on the film surface using photolithographic techniques. The conductive pads are arranged on the film surface in such a way as to conform to the positioning of the edge contact terminals of the chip carrier. A frame structure is provided for resiliently urging the chip carrier against the surface of the film, with the edge terminals of the chip carrier in electrical contact with the raised pads on the film. The conductor lines on the film are also terminated in raised pads, which are urged against a printed wire pattern on a rigid circuit board, which provides connections to the chip carrier test equipment. Thus, electrical contact is made to the chip carrier without the use of wire bonds or solder connections.

Abstract: A mask and solder form for mounting of multi-leaded integrated circuit carriers to printed wiring boards during a soldering process is disclosed. The form comprises a multi-layer composite frame-like structure. The top layer is a translucent sheet, and is provided with a solder and flux strip. The top layer is bonded to a divider layer which is slotted to accept the multi-wire leads of the circuit carrier. The bottom surface of the divider layer is coated with adhesive. The transparent top layer permits precise alignment of the leads of the carrier and the printed wiring board lines. The divider layer blocks the flow of molten solder between leads by providing each wire with its own individual slot. The form is well suited to production loading of the circuit carriers on the printed wiring boards for vapor phase soldering.

Abstract: Multilaminate printed circuit boards have at least three conductor layers separated by two insulator layers. After drilling through the boards, cleaning of the drilled hole is accomplished by forcing a slurry of granular abrasive grit in a liquid carrier through the hole. Manifolds direct the slurry through the holes thereby cleaning them.

Abstract: The shelter is constructed of composite, multilayer panels comprising an exterior skin aluminum sheet layer, a polymer composition foam layer, a divider skin aluminum sheet layer, an aluminum honeycomb layer, and an interior skin aluminum sheet layer. The five layers are bonded together to form the panel. In accordance with one aspect of the invention, the polymer composition foam layer has a scored surface to increase adhesive area and to increase the length of the shear failure line. In another aspect of the invention, the panels are closed out at at least two edges thereof with an extruded polymer-fiberglass closeout bar which is positioned between the inner and outer panel skins at the edge thereof and bonded thereto. These closeout bars are configured for rigid attachment between adjacent panels.