Abstract: A reservoir assembly that holds a non-nicotine pre-vapor formulation in a reservoir includes a reservoir assembly connector assembly defining a connector conduit, and which may be configured to detachably couple with a non-nicotine vaporizer assembly based on a connector element of the non-nicotine vaporizer assembly engaging with the connector conduit of the connector conduit. The reservoir assembly may include an isolation structure configured to move in relation to both the reservoir and the non-nicotine vaporizer connector assembly between a first position where the isolation structure exposes the non-nicotine vaporizer assembly to the reservoir and at least partially obstructs the connector conduit to restrict the connector element from disengaging from the connector conduit, and a second position where the isolation structure isolates the non-nicotine vaporizer assembly from the reservoir and opens the connector conduit to enable the connector element to disengage from the connector conduit.

Abstract: Glass formulations, and a method of converting such glass formulations to glass beads having a refractive index of at least 1.59 and a high level of retroreflectivity, are provided. The methods and formulations provide beads also having high levels of resistance to degradation by environmental exposure.

Abstract: Flexible metal foil catalyst members suitable for use in catalytic devices for combustion engine emission control are prepared by electrophoretic deposition using an aqueous slurry of catalyst support particles. The deposited support layer is of uniform thickness and stable surface area. The catalyst support may then be impregnated with catalytic species and assembled into a catalytic device. The catalyst members from the invention are especially suitable for use in automotive applications, and more especially in electrically heated catalytic devices.

Abstract: The electronic packages of the invention all employ the general materials scheme of a low dielectric constant material (low K material) mounted on a dense, high thermal conductivity (high TC) ceramic base. In this way, the low K material provides the signal transmission paths to and from the I.C. chips housed in the package and thus allows for higher signal transmission speed. The high TC material allows for heat dissipation out of the package. The dense base and/or the low K material may contain metallization in any desired pattern. The low K material is preferably a composite of closed pores in a glass-containing matrix.

Abstract: Ceramics containing AlN and B.sub.4 C are produced from relatively low cost starting materials. The starting materials are combined and heated whereby they react to form AlN and B.sub.4 C. The reacted mixture can optionally be densified thereafter. The starting materials generally include aluminum metal, boron nitride and carbon.

Abstract: A green body to be hot pressed by heating the body and applying pressure in a uniaxial direction to the body for an amount of time wherein the body has at least one non-uniform composition cross section relative to the uniaxial direction which cross section has regions which require differing amounts of shrinkage in the uniaxial direction to achieve maximum density under the pressure and heating for the amount of time, may be hot pressed according to a method including:a) laminating auxiliary material with the green body in the uniaxial direction wherein the auxiliary material includes at least one non-uniform composition cross section relative to the uniaxial direction which cross section has regions which require differing amounts of shrinkage in the uniaxial direction to achieve maximum density under the pressure and heating for the amount of time, whereby the net uniaxial shrinkage required by the laminate to achieve maximum density under the heating and pressure for the amount of time is substantially eq

Abstract: The present invention overcomes the problems caused by certain intergranular phases present during hot pressing. The invention provides a method of removing such problematic intergranular phases while avoiding problems of non-uniformity. In one aspect, the invention encompasses an improvement in a method of sintering a green body by hot pressing, where the green body contains ceramic grains to be sintered and material capable of existing as intergranular phase material during sintering. The improvement embraces hot pressing the body in the presence of a permeable material adapted to receive at least a portion of intergranular phase material as the sintering takes place or after the sintering has been completed.

Abstract: Metallization formulations containing a mixture of AlN and metal are used to form hermetic vias in AlN dielectric bases for electronic packaging. The metal may be W, Mo, or mixtures thereof. The metallization may be cofired with the AlN dielectric base. The metallization is especially useful for making electrically conductive hermetic through-vias in AlN bases.

Abstract: Low sodium hollow glass microspheres containing less than about 3 wt. % Na.sub.2 O are produced from aqueous precursors. The method comprisesa) forming an aqueous glass precursor solution or slurry by combining sources of cations contained in the glass, the solution or slurry comprising all of the glass cations in proportions substantially identical to those in the glass,b) forming the solution or slurry into droplets, andc) heating the droplets to form the microspheres.The precursor may also contain surfactants, blowing agents or other known expedients. Nonionic fluorocarbon surfactants are preferred.The droplets may be formed by spraying or any other known technique. The droplets may be spray dried prior to heating step c).

Abstract: Hermetic package designs for HDMI substrates are discussed. The designs for a hermetically sealed, perimeter-leaded package may have the following features:a) a flat monolithic dielectric base, the base having a flat upper surface and a flat lower surface;b) a zone on the upper surface, in which zone the HDMI device would reside;c) a seal ring surrounding the zone;d) a cover adapted to be hermetically sealed to the seal ring, thereby protecting the HDMI device located in the zone;e) a plurality of conductive vias (inner vias) extending from the upper surface inside said zone downwardly toward the lower surface;f) a plurality of perimeter conductive lead pads located on or in the upper surface about the perimeter of the zone inside the seal ring; wherein(1) the perimeter lead pads are electrically connected to the inner vias, and(2) the inner vias are electrically connected to a surface of the base outside the zone.

Abstract: An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet(e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]. The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.

Abstract: An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet (e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]). The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.

Abstract: Boron nitride green sheets are made of boron nitride powder in an organic binder which leaves no undesirable residue upon pyrolysis in the absence of oxygen. These boron nitride green sheets can be placed on each side of the ceramic green sheet to form a composite for hot pressing ceramic green sheets containing ceramic powder to produce dense ceramic sheets suitable for electronic substrates.

Abstract: An electronic package comprising dielectric layers including a densified aluminum nitride (AlN) base layer and at least one densified AlN-borosilicate glass composite layer bonded thereto is described. Any of the dielectric layers may be metallized with conductive circuit patterns and can contain conductive vias. Production of this package is accomplished by hot pressing a greenware laminate comprising a densified base (e.g., AlN); at least one green sinterable sheet (e.g., AlN-borosilicate glass composite); and a green sheet of non-sinterable material (e.g., boron nitride [BN]). The respective green sheets comprise homogeneous mixtures of the ceramic powders and a binder, e.g., polyethylene. The polyethylene is burnt off during the hot press operation. Residual BN is removed by brushing and/or grit blasting, leaving the finished electronic package, all ceramic elements of which are densified. The package provides superior thermal conductivity, strength, dielectric properties, and silicon-compatibility.

Abstract: Dense ceramic sheets suitable for electronic substrates are prepared by hot pressing ceramic green sheets containing ceramic powder and organic binders which leave no undesirable residue upon pyrolysis in the absence of oxygen. Boron nitride sheets made of boron nitride powder in a similar binder are placed on each side of the ceramic green sheet to form a composite. After hot pressing the composite so as to remove the binder and densify the ceramic, the BN layers are removed.

Abstract: PbO-B.sub.2 O.sub.3 -Ag.sub.2 O glasses having a preferred weight ratio range of 76-88:10-15:2-10 have glass transition temperatures of less than 300.degree. C. and are especially useful for adhering together ceramic substrates such as for attaching integrated circuits to ceramic substrates. The glasses can be formulated with Ag particulates and organics and applied as pastes to provide conductive adhesives.

Abstract: Electronic circuits are made with a ceramic body and electrical components which can be disposed in different layers. Interconnecting means can be provided which are disposed entirely within the body. The ceramic body and the electrical components are sintered to form a monolithic structure in a single firing. The electrical components are formed in layers by mixing the electrical component in a sinterable form with a radiation sensitive material which serves as a binder. After exposure to radiation in the desired pattern the layer is developed to form the desired pattern. Multiple patterns can be formed prior to firing.