Abstract: An improved integrated chip carrier package contains closely spaced electrical leads which facilitates contact with leads from the chip.

Abstract: Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises(a) exposing imagewise said element,(b) applying particulate conductive metal, e.g., nickel, copper, to the unexposed image areas, optionally(c) heating the metal bearing areas, then(d) removing excess metal particles, optionally(e) fixing the particulate metal to the layer by heating, exposing to UV light or mechanical embedding, and(f) plating electrolessly or soldering the metal containing areas. The process can be operated continuously to prepare single and double layer flexible printed circuits, membrane switches, etc.

Abstract: Process for the preparation of flexible circuits formed from flexible photohardenable elements having at least one organic elastomeric polymeric binder which comprises(a) exposing imagewise said element,(b) applying particulate conductive metal, e.g., nickel, copper, to the unexposed image areas, optionally(c) heating the metal bearing areas, then(d) removing excess metal particles, optionally(e) fixing the particulate metal to the layer by heating, exposing to UV light or mechanical embedding, and(f) plating electrolessly or soldering the metal containing areas. The process can be operated continuously to prepare single and double layer flexible printed circuits, membrane switches, etc.

Abstract: Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.

Abstract: Electrically conductive through-holes in a substrate are prepared by (a) laminating a film based plastic photosensitive toner-receptive stratum to at least one surface of the substrate; (b) applying a pressure differential across the stratum covering the substrate holes, the outside pressure exceeding that inside the holes; in either order (c) removing at least one film base or (d) exposing the photosensitive stratum imagewise, (e) adhering metal or catalytic particles to hole walls and image areas, (f) optionally hardening or curing the particulate areas and (g) providing an electrically conductive printed circuit and through-holes, e.g., by plating metal electrolessly, soldering or conjoining the metallized or catalyzed areas.