Patents by Inventor John W. Marciniec

John W. Marciniec has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-density interconnection of temperature sensitive electronic devices
    Patent number: 6716669
    Abstract: Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed.
    Type: Grant
    Filed: October 31, 2002
    Date of Patent: April 6, 2004
    Assignee: Bae Systems Information and Electronic Systems Integration Inc
    Inventors: Kenneth R. Erikson, John W. Marciniec
  • HIGH-DENSITY INTERCONNECTION OF TEMPERATURE SENSITIVE ELECTRONIC DEVICES
    Publication number: 20040023433
    Abstract: Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed.
    Type: Application
    Filed: October 31, 2002
    Publication date: February 5, 2004
    Inventors: Kenneth R. Erikson, John W. Marciniec
  • Thermal mismatch compensation technique for integrated circuit assemblies
    Patent number: 6675600
    Abstract: Techniques for minimizing stress induced by temperature changes in an integrated circuit (e.g., focal plane array or processor) or other such assemblies that include materials having mismatched coefficients of thermal expansion/contraction are disclosed. A thermal interface including a flexible comb-like pattern enables compensation for mismatched coefficients thereby reducing thermal-related stress.
    Type: Grant
    Filed: December 5, 2002
    Date of Patent: January 13, 2004
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Gene A. Robillard, Richard S. Holland, Robert N. Graney, John W. Marciniec, John D. Mullarkey, Paul H. Rourke