Abstract: Digital data, including audio and video, may be communicated at increased data rates by utilizing non-data signal channels in cables to communicate additional data. For data transmission, a reformatter receives data in a first format adapted for communication over the data signal channels of a cable. The reformatter may convert the received data into a second format with one or more additional data signals. The reformatter then utilizes non-data signal channels of the cable to carry the additional data signals. An example non-data signal channel may include a clock signal channel, and the reformatter may fold a clock signal into one or more of the data signals to allow for clock recovery downstream. Data may also be split into two or more subsets and each subset encoded separately, for example with two or more data encoders such as legacy HDMI encoders.

Abstract: Digital data, including audio and video, may be communicated at increased data rates by utilizing non-data signal channels in cables to communicate additional data. For data transmission, a reformatter receives data in a first format adapted for communication over the data signal channels of a cable. The reformatter may convert the received data into a second format with one or more additional data signals. The reformatter then utilizes non-data signal channels of the cable to carry the additional data signals. An example non-data signal channel may include a clock signal channel, and the reformatter may fold a clock signal into one or more of the data signals to allow for clock recovery downstream. Data may also be split into two or more subsets and each subset encoded separately, for example with two or more data encoders such as legacy HDMI encoders.

Abstract: A flexible thin film provides interior miniature conducting contact pads which mesh with the extension pins of a pin grid array to establish a tensioned reliable electrical contact. These contacts each connect to an exterior point which is available for probing even while the pin grid array is inserted in a printed circuit board.

Abstract: A flexible thin film plastic access unit for placement under a pin grid array installed on a printed circuit board. The access unit provides extending exterior flaps having probe-accessible contact pads which connect electrically to each one of the underside pins of the pin grid array and permit identification of each pin that is probed.

Abstract: A heat exchange attachment device for integrated circuits is presented which eliminates any need for contact with adhesive pastes or solder. A snap-on holding piece permits a finned cooling unit to be threaded through an aluminum base plate attached to the pin grid array package so that a threaded shaft of the cooling unit may be screwed into adjustable contact with a beryllium oxide disk mounted on the integrated circuit package.