Patents by Inventor John W. Peyton

John W. Peyton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for slicing semiconductor wafers
    Publication number: 20030170948
    Abstract: An apparatus for slicing semiconductor wafers from a single-crystal ingot includes a web of wire for slicing the ingot into wafers and a frame having a head for supporting the ingot during slicing. The apparatus further includes a controller and a temperature sensor disposed in the head and operable to send a signal to the controller indicating head temperature. The controller is operable to control temperature of a fluid directed to the head in response to the signal thereby to control the head temperature. Methods of slicing wafers are also disclosed.
    Type: Application
    Filed: February 28, 2003
    Publication date: September 11, 2003
    Applicant: MEMC Electronic Materials, Inc.
    Inventors: Milind S. Bhagavat, Dale A. Witte, Steven L. Kimbel, David A. Sager, John W. Peyton