Abstract: A method for aligning and bonding the outer leads of the conductive fingers of a tape-and-semiconductor-chip sub-assembly to a package substrate is disclosed. Each section of tape is provided with an inner support ring and an outer support ring. The conductive fingers extend from under the inner support ring to under the outer support ring. The outer support ring is spaced away from the inner support ring to expose portions of the tape outer leads therebetween. The tape-and-chip sub-assembly is positioned over the package substrate so the outer leads are in register with the appropriate package substrate leads. A deposit of flux is applied to at least one location between the substrate and outer support ring to bond the sub-assembly to the substrate. The bonded outer support ring prevents the sub-assembly from moving so the leads do not become out of register with the substrate prior to and during the lead bonding process.

Abstract: A method and apparatus for storage and removal and handling of photo transparencies is described comprising a spacer for partitioning a predetermined number of transparency slides and tongs which are inserted into the spacer for clamping the predetermined number of slides for removal thereof. The tongs are operated by compressing the tabs on the tongs which spread the tongs' arms apart causing previously clamped slides to be released. When the tabs on the tongs are not compressed, the arms are sufficiently wide to contain the predetermined number of slides partitioned by the spacer.